A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.

A dispensing system includes a frame, a support, a dispensing unit assembly, and a gantry. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis, with a dispensing unit rotatably coupled to the movable bracket configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis. A mass dampener assembly is coupled to the movable bracket, with the mass dampener assembly being configured to reduce vibration of the dispensing unit during operation.

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket by a first strain wave gear system configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis. The dispensing unit assembly further includes a dispensing unit rotatably coupled to the movable bracket by a second strain wave gear system configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis.

Disclosed are examples for printing a one-dimensional (1D) nanomaterial for use in stretchable electronic devices. An ink comprising a nanomaterial solution is dispersed from a pneumatic dispensing system of a printing device. The 1D nanomaterial is printed in a predefined pattern on an underlying substrate positioned on a ground electrode. A voltage is applied between the printing nozzle and the ground electrode to cause the ink to form into a cone during the printing. The substrate can be modified to increase the wettability of the substrate to enhance adhesion of the ink to the substrate.

A method of applying viscous media on a substrate is disclosed. In the method, the substrate is provided, which is arranged for mounting of electronic components thereon. Further, flux is provided on a deposit of solder paste, which deposit is arranged at a predetermined position on the substrate. The flux is provided by a non-contact dispensing process, such as jetting. By providing flux on the deposit prior to reflow, the risk of quality related issues, such as e.g. graping, advantageously is reduced.

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket by a first strain wave gear system configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis. The dispensing unit assembly further includes a dispensing unit rotatably coupled to the movable bracket by a second strain wave gear system configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis.

A flux dotting tool is provided that includes: a housing having an internal space and a plurality of through-holes extending from the internal space to an outside of the housing; a plurality of flux pins disposed in the internal space to correspond to the plurality of through-holes, respectively, wherein each of the plurality of flux pins includes a flux holding portion extending in a first direction and that is exposed to the outside of the housing, and a flux blocking structure protruding in a second direction, perpendicular to the first direction, from a side surface of the flux holding portion, and the flux blocking structure is configured to limit a flux wetting region; and an elastic structure disposed on the plurality of flux pins in the internal space and configured to impart elastic force in the first direction.