A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.

The disclosure relates to systems and methods for using additive manufacturing techniques for fabricating ball grid array (BGA) surface mounting pads (SMP), and surface mounted technology devices (SMT) package sockets. More specifically, the disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA SMP, and or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.

Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

An object of the present invention is to provide a method for forming a conductive thin wire, the method being capable of improving thin wire formability, conductivity, adhesion, and transmittance of a conductive thin wire, a method for producing a transparent conductor, a method for producing a device, and a set of a conductive ink and a base material. This object is achieved by a method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, in which the base material has surface energy of less than 40 mN/m, and conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2≤θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2.

A method of fabricating a cross-layer pattern in a layered object is disclosed. The method is executed by an additive manufacturing system and comprises: dispensing a patterning material onto a receiving medium to form a first pattern element; dispensing a first layer of modeling material onto the first pattern element while forming a first open cavity exposing at least a portion of the first pattern element beneath the first layer; and dispensing patterning material onto the exposed portion of the first pattern element and the first layer to form a second pattern element contacting the first pattern element.

According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.

A circuit formation method includes a wiring formation step of forming a wiring by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and firing the metal-containing liquid, a paste application step of applying a resin paste containing micrometer-sized metal particles to be connected to the wiring formed in the wiring formation step, and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied in the paste application step.

A method of fabricating a cross-layer pattern in a layered object is disclosed. The method is executed by an additive manufacturing system and comprises: dispensing a patterning material onto a receiving medium to form a first pattern element; dispensing a first layer of modeling material onto the first pattern element while forming a first open cavity exposing at least a portion of the first pattern element beneath the first layer; and dispensing patterning material onto the exposed portion of the first pattern element and the first layer to form a second pattern element contacting the first pattern element.

A method of applying viscous media on a substrate is disclosed. In the method, the substrate is provided, which is arranged for mounting of electronic components thereon. Further, flux is provided on a deposit of solder paste, which deposit is arranged at a predetermined position on the substrate. The flux is provided by a non-contact dispensing process, such as jetting. By providing flux on the deposit prior to reflow, the risk of quality related issues, such as e.g. graping, advantageously is reduced.

An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.