A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

The application relates to a doctoring unit for a printing apparatus for printing flat substrates, in particular circuit boards, wafers, or solar cells, comprising two doctor blades, which extend parallel to one another and are pivotably mounted. It is provided that the doctor blades are operatively connected to a gearing, which is formed in a self-locking manner and can be coupled or is coupled to a drive device.

A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including SnBi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

A method of performing a fully automated, single changeover process within a stencil printer includes identifying at least one item for replacement within the stencil printer, transporting an item to the stencil printer by a single change movable cart, removing a used item identified for replacement and delivering the used item to the movable cart, and installing a new item within the stencil printer from the movable cart. A system to perform a fully automated, single changeover process within a stencil printer includes a single change movable cart configured to transport an item to the stencil printer, remove a used item scheduled for replacement, and install the item within the stencil printer.

A stencil printer includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil, a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes, the print head assembly including a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil, and a robotic arm configured to perform functions within the stencil printer.

A delivery device is configured to deliver changeover and/or replacement items within a stencil printer. The delivery device includes a housing configured to support replacement and/or replenishment items, the housing having wheels or casters to enable the housing to roll along a relatively flat surface, at least one support structure configured to store items for the stencil printer, and one or more device configured to transport items from the delivery device to the stencil printer and from the stencil printer to the delivery device.

A system or method of fully automating a changeover and/or a replacement process within a stencil printer includes a stencil printer having at least one item scheduled for replacement within the stencil printer, a stockroom configured to store a plurality of items, and a delivery device. The delivery device is configured to transport an item of the plurality of items to the stencil printer, remove a used item scheduled for replacement, install the item of the plurality of items on the stencil printer, transport the used item to a station configured to inspect and perform one or more functions on the used item to render the used item ready for use, and transport the used item to the stockroom for future use within the stencil printer.

A screen printer that measures a tension of a mask in a machine, including a mask holding device configured to hold a mask; a board device configured to position a board from below with respect to the mask held by the mask holding device; a squeegee device configured to apply and spread a cream solder on an upper surface of the mask; a mask pressing device configured to press the mask at a set pressure by a pusher which is installed on an upper travelling device or a lower travelling device with respect to the mask; a mask measurement device, installed on the upper travelling device or the lower travelling device to be opposed to the pusher, which is configured to measure a height of the mask; and a tension measurement device configured to calculate a tension of the mask based on a measured value of the mask measurement device.

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.