A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.

In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.

A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f- lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A screen printing machine for appropriately contact between a mask and a board, comprising: a mask-holding device configured to hold a mask; a board-positioning device configured to hold a board and to position the held board with respect to a mask held by the mask-holding device from below; a squeegee device configured to spread a cream solder with respect to the mask; a height-measuring device configured to measure the height of the mask and the board; a control device configured to control each device, and to calculate the thickness of a mask lower layer, integrally formed with the mask, based on the measurement values obtained from the height-measuring device; and an operation display device configured to input operation and to display calculation values from the control device, and the like.

A screen printer comprising: a conveyance device configured to convey a board; a board holding device configured to position a conveyed board at a printing position; a stencil holding device configured to attach a stencil above the held board; a squeegee device configured to fill pattern holes of the stencil with solder paste; a board raising and lowering device configured to raise and lower the board positioned by the board holding device; and a control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal.

Sheet comprising a flexible support and a coating at least partially covering at least one face of the support, the support being made of a support material exhibiting dielectric properties, the coating being made of a coating material different from the support material and exhibiting magneto-dielectric properties or dielectric properties.

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).