H05K2203/0143

GRAVURE-PRINTED DEVICES AND METHOD OF PRODUCING SUCH DEVICES
20190329576 · 2019-10-31 · ·

A method of printing a discontinuous image on a device using a gravure printing process which is susceptible to feathering, the device including: a substrate, and an image layer superposed with at least a portion of the substrate, the image layer including the discontinuous image, the discontinuous image having at least one leading edge during printing, the method including: printing a plurality of anti-feathering elements in an extended edge region of the image layer adjacent the leading edge, the anti-feathering elements being printed before the leading edge of the discontinuous image, the anti-feathering elements and discontinuous image being printed in the same rotary action, wherein the plurality of anti-feathering elements are indiscernible to the naked eye.

Conductive pattern formation method and conductive pattern formation device

A conductive pattern formation method includes: a step of patterning a base member with an ink in which conductive particulates are distributed to form a pattern; a step of making a conductive developer act on the pattern; and a pressurization step of pressurizing the pattern.

Method for gapping an embedded magnetic device
10431367 · 2019-10-01 · ·

A method for gapping a magnetic component is disclosed. The method includes: forming a feature on a substrate, the feature being a depression defining an inside surface; disposing a first conductive pattern on the substrate and the inside surface of the feature; disposing a permeability material on the inside surface of the feature and the first conductive pattern; disposing a substrate material on the substrate and the feature; disposing a second conductive pattern on the substrate material to wrap the permeability material between the first conductive pattern and the second conductive pattern to define at least one electrical circuit to facilitate a magnetic field in the permeability material; and gapping the permeability material to remove at least a portion of the permeability material to produce a gap in the at least a portion of the permeability material.

Sensing Decal
20190289722 · 2019-09-19 ·

A method of manufacturing a sensing decal (400), a sensing decal and a method of providing a sensing decal to a device (702), in which the method of manufacture providing a flexible release layer (401) having a substantially non-uniform surface (405) and printing a conductive ink layer (402) onto the non-uniform surface. An adhesive layer (403) is printed onto the conductive ink layer to produce the sensing decal. The decal can then be applied to a surface (701) of a device and the flexible release layer is removed.

Coil coating process

A coil coating method for multilayer coating of a continuous metal strip, which is disposed in the strip passage, in which on a flat side of the metal strip, a curable polymer primer is applied by means of a roller application and cured in order to form an electrically insulating primer layer and a curable polymer varnish is applied onto said primer layer by means of roller application and cured in order to form an electrically insulating varnish layer, wherein at least one at least electrically conductive conductor track is printed on at least some areas between the primer layer and the varnish layer is proposed. In order to increase the reproducibility of the coil coating method, it is proposed that the conductor track be printed on some areas of the pre-cured primer layer and that the conductor track and varnish be applied using a wet-on-wet process.

COATINGS AND PROCESSING OF TRANSPARENT CONDUCTIVE FILMS FOR STABILIZATION OF SPARSE METAL CONDUCTIVE LAYERS
20240161943 · 2024-05-16 ·

Transparent conductive films comprising sparse metal conductive layers are processed after coating with an overcoat to lower the sheet resistance of the film. The sparse metal conductive layer can comprise a fused metal nanostructured network. A coating, such as a polymer overcoat or a polymer undercoat can noble metal ions that can further reduce the sheet resistance with the application of heat and optionally humidity. In particular, silver ions in a coating are demonstrated to provide important stabilization of sparse metal conductive layers, whether or not fused, upon the application of heat and humidity. A coating can further comprise a metal salt stabilization composition.

System and Method for Controlling Powder Bed Density for 3D Printing

A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.

Printing an electrical device using flexographic plate with protective features
10334739 · 2019-06-25 · ·

A printed electrical device is formed using a flexographic printing system. A flexographic printing plate having a pattern of raised features includes an active region having a plurality of parallel traces separated by a trace spacing of between 5-40 microns that are used to form active micro-traces that provide an electrical function, and an inactive region adjacent to the active region having one or more protective features that are used to form electrically-inactive features. The protective features are separated from an outermost trace of the plurality of traces by a gap distance of between 60% and 250% of the trace spacing. The flexographic printing plate is used to transfer ink from an anilox roller to a substrate to provide a printed pattern corresponding to the pattern of raised features on the flexographic printing plate.

A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE WITH AT LEAST ONE PATTERNED LAYER

The document relates to a method of producing a product comprising a substrate with at least one 2D-patterned layer from a multilayer material (1), wherein the multilayer material (1) is passed through at least one nip (6, 6a, 5 6b), provided by a milling cutter (51, 51a, 51b) cooperating with a patterned cliche cylinder (52, 52a, 52b), to selectively remove predetermined portions of material from at least a first layer (10) of the multilayer material (1) in accordance with a pattern of the patterned clich? cylinder (52, 52a, 52b), whereby the 2D-patterned layer is formed from the first layer (10). The method comprises: providing the multilayer material (1) comprising at least the first layer (10) and a second layer (20); feeding the multilayer material (1) through a first such nip (6, 6a) to partially, as seen in a thickness direction of the first layer (10), remove at least some of the predetermined portions of material from the first layer (10); and feeding the multilayer material (1) through a second such nip (6, 6b) to remove a remainder of said at least some of the predetermined portions of material.

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHOD
20240188228 · 2024-06-06 · ·

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.