The invention refers to a method for assembling at least one lighting element onto a substrate, the method comprising: pre-assembling at least one lighting element onto a temporary carrier; pre-assembling at least one reference element onto the temporary carrier; aligning the pre-assembled temporary carrier onto the substrate based, at least in part, on the at least one reference element of the temporary carrier; and mounting the at least one lighting element onto the substrate. The invention further relates to substrate comprising: at least one lighting element, wherein the at least one lighting element is assembled onto the substrate, in particular by a method according to the first aspect of the present invention, and to a use of a method for assembling at least one lighting element onto a substrate.

A component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; a heat removing and electrically conductive base structure; a component which is connected to the base structure so as to at least partially protrude from the base structure and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure on or above a top main surface of the component. A method of manufacturing such a component carrier is disclosed.

A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.

According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.

A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 μm or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.

A manufacturing method of a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. An insulating layer is formed to cover a peripheral region of the stainless steel layer and expose a central region. A circuit structure layer is formed on the central region exposed by the insulating layer. A bottom surface of the circuit structure layer is connected to the first carrier board. A transferring procedure is performed to adhere a top surface of the circuit structure layer onto an adhesive layer of a second carrier board. The first carrier board is separated with the circuit structure layer to transfer the circuit structure layer onto the second carrier board, and expose the bottom surface of the circuit structure layer. The manufacturing method of the circuit board of the present invention is safer and simpler, may effectively reduce the manufacturing costs and improve the product yields.

A solid state die such as an LED (or OLED) die that is fitted in a hole such as a through hole in a carrier substrate such as a PCB. The die is to be connected to the PCB e.g. to tracks on the PCB. The electrical contacts on the die are arranged to be (e.g. substantially) in the same plane as the contacts on the carrier substrate such as the PCB. This is achieved by the holes in the substrate such as the PCB being adapted so that the dies fit into the holes or openings, i.e. are each taken up into an opening before electrical contacts are made.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

A method includes forming a redistribution structure on a carrier substrate, coupling a first side of a first interconnect structure to a first side of the redistribution structure using first conductive connectors, where the first interconnect structure includes a core substrate, where the first interconnect structure includes second conductive connectors on a second side of the first interconnect structure opposite the first side of the first interconnect structure, coupling a first semiconductor device to the second side of the first interconnect structure using the second conductive connectors, removing the carrier substrate, and coupling a second semiconductor device to a second side of the redistribution structure using third conductive connectors, where the second side of the redistribution structure is opposite the first side of the redistribution structure.