A flexible circuit board including a substrate with a first side and an opposing second side, wherein the substrate is of a colorless polyimide; first and second circuit patterns formed by deposition of ink on the first and second sides, respectively; at least one opening to interconnect the first and second circuit patterns; and first and second cover layers applied on the first and second circuit patterns, respectively, wherein the first and second cover layers are of a colorless polyimide.

A semi-automatic corrosion box of a copper clad laminate is disclosed. The corrosion device comprises a box body which has no cover; a baffle plate which divides the corrosion box into an upper part and a lower part, wherein a copper clad laminate circuit board is placed on the baffle plate, and a temperature detection module, water pumps and a heating rod are placed on a lower part; and a thermal imaging camera which is placed on a pressing plate through a bracket. Modules in corrosive liquid are connected with an external single chip microcomputer control module through corrosion-resistant wires. The working mode of the present invention is that time and temperature are set with a key matrix at first, and the control module can automatically stop working and enter a low power consumption mode.

A printed circuit board for an electric component contains an electrically insulating substrate which has a surface and at least one electrically conductive conductor track formed within the substrate. The surface of the substrate has a sealing region which is arranged and/or configured such that the sealing region is flat and/or the substrate has a homogenous substrate thickness in the sealing region. An overmolding which adjoins the sealing region is arranged on the surface of the substrate.

The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.

A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

A manufacturing method of a component embedded package carrier includes the following steps: providing the dielectric layer; a first copper foil layer and a second copper foil layer; forming a plurality of through holes; forming a conductive material layer on the first copper foil layer and the second copper foil layer; patterning the conductive material layer, the first copper foil layer and the second copper foil layer, thereby defining the conductive through hole structures, the first patterned conductive layer and the second patterned conductive layer and forming the core layer comprises; disposing at least one electronic component inside the opening of the core layer; laminating a first insulating layer and a first circuit layer located on the first insulating layer onto the first patterned conductive layer; laminating a second insulating layer and a second circuit layer located on the second insulating layer onto the second patterned conductive layer.

A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.

Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

A conveyor system for a stencil printer includes a pair of rail members extending through a frame and configured to transport the substrate through the stencil printer. A lift tool assembly is configured to support the substrate at a transport height and a print height. The lift tool assembly includes a lifter portion configured to be engaged by a support of the lift table assembly. A foot of the lifter portion has at least two permanent magnets configured to secure the foot of the lifter portion to the support when engaging the support to the lifter portion, and at least one vacuum pocket formed in a bottom surface of the foot of the lifter portion. The vacuum pocket is configured to selectively secure the lifter portion in place on the support.