A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

In an embodiment, a chip protection envelope includes a first dielectric layer including at least one organic component having a decomposition temperature of at least 180 C., a semiconductor die embedded in the first dielectric layer, the semiconductor die having a first surface and a thickness t.sub.1. A second dielectric layer is arranged on a first surface of the first dielectric layer, the second dielectric layer including a photodefinable polymer composition, and a conductive layer is arranged on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The conductive layer has a thickness t.sub.2, wherein t.sub.2t.sub.1/3.

A method for forming a three-dimensional object with at least one conductive trace comprises providing an intermediate structure that is generated (e.g., additively or subtractively generated) from a first material in accordance with a model design of the three-dimensional object. The intermediate structure may have at least one predefined location for the at least one conductive trace. The model design includes the at least one predefined location. Next, the at least one conductive trace may be generated adjacent to the at least one predefined location of the intermediate structure. The at least one conductive trace may be formed of a second material that has an electrical and/or thermal conductivity that is greater than the first material.

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.

A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

[Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties. [Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.0 m, and the total content of the photopolymerizable resin precursor (B) is 10 to 24 mass % relative to the total mass of the photocurable electroconductive ink composition, and the content of the oligomer of urethane acrylate is 5 mass % or less relative to the total mass of the photocurable electroconductive ink composition, and the content of the alkyd resin (C) is 1 to 10 mass % relative to the total mass of the photocurable electroconductive ink composition.

A circuit pattern is quickly created or changed by exposing the circuit pattern on a board without using a photo mask on which the circuit pattern is formed. There is provided a circuit pattern manufacturing apparatus including a forming unit that forms a circuit pattern by irradiating, with a light beam, a circuit pattern forming sheet including an insulating sheet base material layer and a mixture layer made of a mixture containing a conductive material and a photo-curing resin. The forming unit includes, as an optical engine, a housing, a laser diode, a prism mirror, an inclined mirror, a bottom mirror, and a driving mirror.

A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.

In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

A precursor article has a substrate and a photosensitive thin film or a photosensitive thin film pattern on a supporting side. The photosensitive thin film and each photosensitive thin film patterns comprises a non-hydroxylic-solvent soluble silver complex that is represented by the following formula (I):

(Ag.sup.+).sub.a(L).sub.b(P).sub.c (I)

wherein L represents an -oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. A photosensitizer that can either reduce the reducible silver ion or oxidize the -oxy carboxylate having a reduction potential can also be present. Such precursor articles can be irradiated with UV-visible radiation to reduce the silver ions to provide electrically-conductive metallic silver in thin films or thin film patterns in product articles or devices.