A circuit board includes a board body, a first electrode, and a second electrode. The board body contains a resin material. The first electrode is disposed on a first main surface of the board body and includes a first electrode base and a first coating film that covers at least a part of an outer surface of the first electrode base. The second electrode is disposed on the first main surface of the board body and includes a pillar-shaped structure that includes a second electrode base, a first plating film that is disposed on the second electrode base, and a first plating structure having a first end directly connected to the first plating film, and a second coating film that covers at least a part of an outer surface of the pillar-shaped structure.

A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than of an average particle size of the insulating particles.

A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.

A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.

A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.

The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.

An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method.

A circuit board includes a first wiring layer and a build-up structure. The build-up structure includes at least one dielectric layer and at least one second wiring layer. Each dielectric layer and each second wiring layer are alternately arranged. The at least one dielectric layer comprises an outermost dielectric layer. The at least one second wiring layer is formed on a side of the outermost dielectric layer, and comprises an outermost second wiring layer. A portion of the first wiring layer is embedded in a side of the outermost dielectric layer facing away the outermost second wiring layer, a remaining portion of the first wiring layer protrudes from the outermost dielectric layer. A method for manufacturing a circuit board is provided.

The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.