The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated.

A printed circuit board includes a first insulating layer; a first wiring layer buried in the first insulating layer, exposed to one surface of the first insulating layer, and including a plurality of first wiring patterns; a second wiring layer including a plurality of second wiring patterns spaced apart from the plurality of first wiring patterns on the one surface of the first insulating layer; and a second insulating layer disposed on the one surface of the first insulating layer and covering the plurality of second wiring layers. At least a portion of the plurality of second wiring patterns on the one surface of the first insulating layer is disposed in regions between adjacent first wiring patterns among the plurality of first wiring patterns.

Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

A true random number generator is presented that includes a CMOS matrix detector with a top surface. A shell is positioned over the top surface, and the shell includes a radiation source and a luminophore or scintillator constructed to emit photons towards the top surface when the luminophore or scintillator is struck by electrons from the radioactive decay of the source of the radiation. The CMOS detector matrix is constructed to detect the photons emitted from the luminophore or scintillator and to produce a signal for the detected photons. The signal is communicated to a processor that produces true random numbers based on the signal from the detected photons.

A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of: a1) providing a multi-layer substrate comprising (i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers, (ii) a cover layer, and (iii) a microvia extending from the peripheral surface and ending on the conductive interlayer; b1) depositing a conductive layer; or a2) providing a multi-layer substrate comprising (i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers, (ii) a microvia extending from the peripheral surface and ending on the conductive interlayer; b2) depositing a conductive layer; and c) electrodepositing a copper filling in the microvia and a first copper layer on the conductive layer which form together a planar surface and the thickness of the first copper layer is from 0.1 to 3 μm.

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of: a) providing a multi-layer substrate; b) forming a non-copper conductive layer or a copper layer on the cover layer and on an inner surface of the through-hole, respectively on an inner surface of the grate structure; c) forming a patterned masking film; d) electrodepositing copper; e) removing the masking film; and f) electrodepositing a copper filling.