A semi-automatic corrosion box of a copper clad laminate is disclosed. The corrosion device comprises a box body which has no cover; a baffle plate which divides the corrosion box into an upper part and a lower part, wherein a copper clad laminate circuit board is placed on the baffle plate, and a temperature detection module, water pumps and a heating rod are placed on a lower part; and a thermal imaging camera which is placed on a pressing plate through a bracket. Modules in corrosive liquid are connected with an external single chip microcomputer control module through corrosion-resistant wires. The working mode of the present invention is that time and temperature are set with a key matrix at first, and the control module can automatically stop working and enter a low power consumption mode.

A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.

A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

A cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a source of fluid. The manifold includes at least one outlet. The at least one cleaning module further includes an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles and a pressure sensor coupled to the automatic valve. The pressure sensor is configured to measure pressure of fluid flowing through the conduit. The automatic valve is configured to adjust the flow of fluid through the conduit based on the pressure measured by the pressure sensor.

A printed wiring board includes a copper foil pattern on a base material, a solder resist uniformly provided on the copper foil pattern so as to cover the copper foil pattern, and an outline character forming layer provided in a part where characters are not formed so that outline characters are formed on the solder resist. A method of manufacturing the printed wiring board includes a step of forming the copper foil pattern on the base material, a step of uniformly forming the solder resist on the copper foil pattern so as to cover the copper foil pattern, and a step of forming the outline character forming layer on the solder resist. The solder resist is formed by applying it by a spray method.

A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.