A cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a source of fluid. The manifold includes at least one outlet. The at least one cleaning module further includes an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles and a pressure sensor coupled to the automatic valve. The pressure sensor is configured to measure pressure of fluid flowing through the conduit. The automatic valve is configured to adjust the flow of fluid through the conduit based on the pressure measured by the pressure sensor.

The invention relates to a suction-extraction apparatus for extracting a treatment fluid by suction from an essentially planar treatment surface (3a) of treatment substrates (3) transported by means of transporting rollers (8, 10) along an essentially horizontal transporting direction, having a suction source, having a suction-extraction-control unit, which activates the same, and having a suction-extraction-tube unit, which is connected to the suction source and has at least one suction-extraction lance, which can have one or more entry-side suction-extraction-nozzle openings positioned at a suction-extraction distance from the treatment surface. The invention also relates to an etching apparatus equipped with such a suction-extraction apparatus. In the case of a suction-extraction apparatus according to the invention, the suction source and the suction-extraction-control unit are designed for a suction-volume flow per suction-extraction lance of at least 30 m.sup.3/h and a negative suction pressure of no more than 8 kPa. In addition, or as an alternative, the suction-extraction lance has a comb-like suction-extraction structure with a suction-extraction-collecting tube (17) and a plurality of suction-extraction tubes (18) which extend in a comb-like manner from said collecting tube and have the suction-extraction-nozzle openings (19) on the entry side. Use, for example, for etching printed circuit boards, conductor foils or semiconductor wafers.

A semi-automatic corrosion box of a copper clad laminate is disclosed. The corrosion device comprises a box body which has no cover; a baffle plate which divides the corrosion box into an upper part and a lower part, wherein a copper clad laminate circuit board is placed on the baffle plate, and a temperature detection module, water pumps and a heating rod are placed on a lower part; and a thermal imaging camera which is placed on a pressing plate through a bracket. Modules in corrosive liquid are connected with an external single chip microcomputer control module through corrosion-resistant wires. The working mode of the present invention is that time and temperature are set with a key matrix at first, and the control module can automatically stop working and enter a low power consumption mode.

Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 m. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.

Example methods of calibrating a parameter in a fluxing process in a soldering machine involve: determining an expected flux result when at least one calibration flux setting is used to spray flux from a nozzle; spraying flux from the nozzle using the at least one calibration flux setting; measuring the obtained flux result when flux is sprayed using the at least one calibration flux setting; calculating the difference between the measured obtained flux result and the expected flux result; and calculating a flux result correction factor corresponding to the at least one calibration flux setting, wherein the flux result correction factor is applicable to the soldering machine during a fluxing process, to reduce the difference between the sprayed flux result and the expected flux result.

The disclosure discloses a packaging method and a packaging device for a PCBA board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board; the maximum height of the electronic element relative to surface of the printed circuit board is less than 1 cm. The packaging method comprising: during glue spraying process, controlling a glue spraying assembly to spray UV glue liquid to a target spraying area of the PCBA board by moving back and forth in a straight line in a horizontal direction. The packaging method for a PCBA board provided by the present disclosure realizes packaging and protection of electronic components by spraying UV glue liquid to an area of the PCBA board that needs protection by the glue spraying assembly.

A cleaning apparatus is configured to clean electronic substrates including printed circuit boards and semiconductor product assemblies. The cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a spray system having a manifold connected to a source of fluid and a plurality of spray bars fluidly coupled to the manifold, and an adjustable height spray system configured to move the manifold and the plurality of spray bars up and down with respect to the conveyor system.

An etching device includes a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part. The etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.