Patent classifications
H05K2203/0759
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
A transparent article is prepared with a transparent polymeric film and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent polymeric film. Such pattern has, in order outwardly from a surface of the transparent polymeric film: a metallic pattern having a first surface facing the transparent polymeric film and an opposing second surface; and a pattern of a catalytic ink disposed over at least a portion of the opposing second surface. Such articles can be prepared by A-1) providing a pattern of a catalytic ink on the surface of the first substrate; A-2) curing the catalytic ink pattern sufficient to form a cured catalytic ink pattern; A-3) electrolessly plating a metal onto the cured catalytic ink pattern to form the metallic pattern on the surface of the first substrate, and B) transferring the metallic pattern to a surface of a second substrate that is a transparent laminating film.
Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas
A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
ELECTRONIC TRANSMISSION CONTROLLER, AND METHOD FOR PRODUCING SAME
The present disclosure relates to an electronic transmission controller, with a housing, a printed circuit board assembly, and at least one electronic module mounted on the printed circuit board assembly. The printed circuit board assembly may include a first region extending inside the housing, the first region being sealed from an external fluid. The printed circuit board assembly may include a second region extending outside the housing. The printed circuit board assembly may include a plurality of electrically conductive conductor path layers which are electrically insulated against one another by dielectric layers. An outer layer made of a fluid resistant and electrically insulating material may be applied to at least one outer electrically conductive conductor path layer of the plurality of conductive path layers at a location of the second region of the printed circuit board assembly.
DIRECTING MOTION OF DROPLETS USING DIFFERENTIAL WETTING
Apparatus for controlling motion of liquid droplets. A set of electrode pads is arranged to define one or more tracks over which liquid droplets may be induced to move over a sequence of the electrode pads. A surface over the electrode pads is dielectric, smooth, and slippery to the droplets. In some cases, the smooth surface is formed as a thin layer of a second liquid that is immiscible with the liquid of the droplets. The surface has wetting affinity to the liquid that can be individually varied in a controlled manner by application of voltage to respective electrode pads. A control is designed to alter the wetting characteristic of varying-wettability portions of the surface over respective electrode pads to effect induced motion of the droplets over the surface. The apparatus is designed with the smooth hydrophobic surface open, with no overlying or facing electrode or plate above the droplets.
MULTILAYER ADDITIVE PRINTED CIRCUIT
A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.
CIRCUIT ASSEMBLIES AND METHOD OF MANUFACTURE THEREOF
Disclosed herein is a circuit assembly including a polyetherimide dielectric layer; a conductive metal layer disposed on the dielectric layer; and a supporting metal matrix layer disposed on the dielectric layer on a side opposite the conductive metal layer. The polyetherimide dielectric layer includes a polyetherimide having a glass transition temperature of 200 C. or more. The circuit assembly has the same adhesion, within+10%, as determined by IPC-TM-650 test methods, before and after thermal stress at 280 C. for 30 minutes in accordance with SJ 20780-2000. Also disclosed are methods of preparing the circuit assembly, and articles including the circuit assembly.
MULTI-LAYERED 3D PRINTED LASER DIRECT STRUCTURING FOR ELECTRICAL INTERCONNECT AND ANTENNAS
A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
Liquid composition and metal-based circuit board
A liquid composition containing a liquid crystalline polyester, a solvent, and a boron nitride having a volume average particle diameter of not less than 10 m and not more than 80 m, wherein the amount of the boron nitride is 30 to 90% by volume based on the total amount of the liquid crystalline polyester and the boron nitride.
Inkjet ink for printed circuit boards
A radiation curable inkjet ink comprising a polymerizable compound, a photoinitiator characterized in that the inkjet ink further comprises a di- or multifunctional alkoxysilane and a monofunctional alkoxysilane functionalized with a group selected from the group consisting of an epoxide and an oxetane.
DIRECTING MOTION OF DROPLETS USING DIFFERENTIAL WETTING
Apparatus for controlling motion of liquid droplets. A set of electrode pads is arranged to define one or more tracks over which liquid droplets may be induced to move over a sequence of the electrode pads. A surface over the electrode pads is dielectric, smooth, and slippery to the droplets. In some cases, the smooth surface is formed as a thin layer of a second liquid that is immiscible with the liquid of the droplets. The surface has wetting affinity to the liquid that can be individually varied in a controlled manner by application of voltage to respective electrode pads. A control is designed to alter the wetting characteristic of varying-wettability portions of the surface over respective electrode pads to effect induced motion of the droplets over the surface. The apparatus is designed with the smooth hydrophobic surface open, with no overlying or facing electrode or plate above the droplets.