A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.

Apparatus for controlling motion of liquid droplets. A set of electrode pads is arranged to define one or more tracks over which liquid droplets may be induced to move over a sequence of the electrode pads. A surface over the electrode pads is dielectric, smooth, and slippery to the droplets. In some cases, the smooth surface is formed as a thin layer of a second liquid that is immiscible with the liquid of the droplets. The surface has wetting affinity to the liquid that can be individually varied in a controlled manner by application of voltage to respective electrode pads. A control is designed to alter the wetting characteristic of varying-wettability portions of the surface over respective electrode pads to effect induced motion of the droplets over the surface. The apparatus is designed with the smooth hydrophobic surface open, with no overlying or facing electrode or plate above the droplets.

A physically compliant, 3-dimensional, heterogeneously integrated system includes electronics that have a metal-oxide-semiconductor structure; plural graphene-based sensors; interconnects configured to electrically connect the electronics to the plural graphene-based sensors; and a first polymer layer that extends between the electronics and the plural graphene-based sensors so that the electronics are prevented from directly contacting the plural graphene-based sensors. The electronics, the plural graphene-based sensors, the interconnects, and the first polymer layer are configured to have a thickness that allow the entire system to bend to have a bending radius less than 10 mm.

Methods for forming circuit boards and circuit boards using an adhesion layer are described. A substrate with two surfaces is exposed to a bifunctional organic compound to form an adhesion layer on the first substrate surface. A resin layer is then deposited on the adhesion layer and the exposed substrate surfaces. Portions of the resin layer may be removed to expose metal pads for contacts.

A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

Disclosed is a process that utilizes a modified Atom Transfer Radical Polymerization (ATRP) process to form a water-resistant coating in situ on a substrate. The process uses solvent soluble monomers, initiator and ligand to form a solvent insoluble water-resistant polymer coating that is deposited directly onto a metal trace on the substrate. The process is especially useful for providing a water-resistant coating to the circuits on a printed circuit board, wearable electronics, and biological sensors. The process can be run in an aqueous solvent in the open atmosphere and does not require a vacuum, heating steps or masking. The coating is deposited only on the metal trace and closely adjacent areas of the substrate.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.