A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.

A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.

Apparatus for controlling motion of liquid droplets. A set of electrode pads is arranged to define one or more tracks over which liquid droplets may be induced to move over a sequence of 5 the electrode pads. A surface over the electrode pads is dielectric, smooth, and slippery to the droplets. In some cases, the smooth surface is formed as a thin layer of a second liquid that is immiscible with the liquid of the droplets. The surface has wetting affinity to the liquid that can be individually varied in a controlled manner by application of voltage to respective electrode pads. A control is designed to alter the wetting characteristic of varying-wettability portions of 10 the surface over respective electrode pads to effect induced motion of the droplets over the surface. The apparatus is designed with the smooth hydrophobic surface open, with no overlying or facing electrode or plate above the droplets.

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.

A display apparatus and a manufacturing method thereof are provided. The display apparatus includes a printed circuit board on which a plurality of light emitting diodes (LEDs) is mounted; a frame configured to support the printed circuit board, and including a frame hole passing through the frame; a chassis coupled to the frame, and including a chassis hole configured to correspond to the frame hole; and a bonding member positioned between the printed circuit board and the frame, through the frame hole and the chassis hole, the bonding member configured to bond the frame to the printed circuit board.

In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 μm on a surface of the copper corrosion inhibitor layer.

A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.

Various embodiments are directed to a method of forming an apparatus including placing a first electronic circuit in contact with a second electronic circuit, wherein each of the first and second electronic circuits have connector circuits configured and arranged to provide an electrical connection between the first and second electronic circuits and are formed with a polymer film that is configured to adhere, via self-healing, to another polymer film. The method further includes, in response to the contact, causing or facilitating the self-healing of the respective polymer films of the first and second electronic circuits, thereby creating the electrical connection therebetween.

This invention is directed to substrates and articles utilizing these substrates that provide improved performance of printable electronics on polymer substrates. In particular, the improved substrates relate to polymer films and electrical conductors printed on them. Application of a thin polymeric coating to the polymer film provides the improved performance of the printed conductors.