A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 m or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.

Conductive adhesive compositions, jettable ink adhesive compositions, printed electronics incorporating the conductive adhesive compositions, and methods for preparing the same are provided. The conductive adhesive composition may include a eutectic metal alloy, an amine, and a solvent, and the eutectic metal alloy may include gallium, indium, and optionally tin.

A method of manufacturing a System in Package (SiP) module includes: welding required electronic units by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB for obtaining a PCB assembly (PCBA) of the SiP module; pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials covers the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA for obtaining a plurality of the SiP modules.

Certain examples relate to encoding data into three-dimensional objects. In one case, a location of a set of terminals to be accessed on an outer surface of the object after fabrication is determined. A mapping between data to be encoded and an electrical property to be measured via a conductive coupling and an embedded electrical structure with the electrical property are determined. Control data is generated to instruct the fabrication of the object with the set of terminals and the embedded electrical structure.

A continuous coating device for continuously conveying a long film includes a coating roll, an imaging device and a coating head. The long film is wound onto the coating roll. The imaging device is configured to capture an image of a mark or a pattern on the long film wound onto the coating roll. The coating head is configured to coat the long film wound onto the coating roll with a specific pattern. The coating head is disposed downstream from the imaging device in a conveyance direction of the long film.

A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.

An ear-worn electronic device is configured to be worn by a wearer and comprises a housing configured to be supported at, by, in or on the wearer's ear. A processor is disposed in the housing. A speaker or a receiver is operably coupled to the processor. A radio frequency transceiver is disposed in the housing and operably coupled to the processor. An antenna is disposed on or in the housing and operably coupled to the transceiver. The antenna comprises a radiating element, a ground plane, and a substrate disposed between the radiating element and the ground plane. The substrate comprises one or both of a dielectric gel and a dielectric liquid.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 m on a surface of the copper corrosion inhibitor layer.

A liquid ejection device (1) comprising: a first tank (2) for retaining a liquid composition; a head (3) for ejecting the liquid composition; a first heater (4) for heating the liquid composition; a first channel (5); a second heater (6) for heating the liquid composition passing through the first channel (5) at a heating temperature higher than that of the first heater (4); a second channel (7); a second pump (8); and a first pump (9), wherein the temperature difference between the heating temperature of the second heater (6) and the heating temperature of the first heater (4) is 65 C. or less.