The present invention relates to a method for increasing adhesion strength between a surface of a copper, a copper alloy or a copper oxide and a surface of an organic material.

The present invention discloses a surface tension driven flexible electronics transfer printing method which uses a surfactant liquid membrane or a surfactant bubble as a transfer printing stamp, to realize the transfer printing of an electronic device with nanometer/micron/submillimeter thickness. A process of transfer printing is transparent and visible in a what you see is what you get manner to realize the accurate positioning of the electronic device. A local load technology is introduced, which is suitable for arbitrary complex curved substrate to realize diverse transfer printing. The electronic device can be transfer-printed to an application substrate with extremely-low interfacial adhesion, without the requirement for the strong and weak adhesion switching strategy of the traditional transfer printing. An unbearable electronic device membrane can be transfer-printed to an fragile receiving substrate with no loss or low loss, without the introduction of pre-pressure.

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

An electronic device module adapted to be removably attached by a heat-resistant tape includes a substrate, a waterproof enclosure and an electronic device. The substrate has a front surface and a rear surface that is opposite to the front surface. The waterproof enclosure is disposed on the rear surface of the substrate to form a closed path and is adapted to be attached by the heat-resistant tape so as to be interposed between the rear surface and the heat-resistant tape. The electronic device is formed on the front surface of the substrate.

The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a substrate and a conductive structure disposed on the substrate, the conductive structure includes a conductive pattern made of a conductive paste and positive ions, the conductive pattern includes conductive particles and a resin, the positive ions are attached to the resin among the conductive particles. The technical solutions of the present disclosure are able to make the resistance of the conductive structure independent of drying and curing process without changing the existing conductive paste material system.

According to an embodiment of the present invention, a substrate for a printed circuit board, the substrate including a resin film and a metal layer deposited on at least one surface of the resin film, includes a modified layer on the surface of the resin film on which the metal layer is deposited, the modified layer having a composition different from another portion, in which the modified layer contains a metal, a metal ion, or a metal compound different from a main metal of the metal layer. The content of a metal element of the metal, the metal ion, or the metal compound on a surface of the modified layer is preferably 0.2 atomic % or more and 10 atomic % or less.

A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.

A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent.

A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.

According to an embodiment of the present invention, a substrate for a printed circuit board, the substrate including a resin film and a metal layer deposited on at least one surface of the resin film, includes a modified layer on the surface of the resin film on which the metal layer is deposited, the modified layer having a composition different from another portion, in which the modified layer contains a metal, a metal ion, or a metal compound different from a main metal of the metal layer. The content of a metal element of the metal, the metal ion, or the metal compound on a surface of the modified layer is preferably 0.2 atomic % or more and 10 atomic % or less.