A self-healing wire includes, an electric wire arranged on a substrate, and a hybrid structure in which the electric wire is covered with at least one fluid selected from the group consisting of a fluid having conductive particles dispersed therein and a fluid having metal ions dissolved therein, formed on a healing portion for a crack to be generated in the electric wire. And a stretchable device includes the self-healing wire formed on a stretchable base material and an electric element mounted only on a base material higher in rigidity than the stretchable base material. Even when a crack is generated in the electric wire due to stretching of the substrate having flexibility, the crack is bridged by the conductive particles or a solid metal deposited from the metal ions in the fluid. Thus the self-healing wire and the stretchable device having both high conductivity and high stretchability are provided.

A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.

In a method for preparing a printed circuit board assembly (PCBA), the PCBA has a base circuit board having a plurality of electronic components installed thereon. First, the surface of the PCBA is cleaned with a cleaner. After cleaning, the staking material is applied around the plurality of electronic components around the circumference of the plurality of electronic components. After applying the staking material, the PCBA with the staking material is cured and inspected.

One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

In one aspect, a liquid-based encapsulation system includes an electronic material having a plurality of exposed surfaces; and an encapsulating liquid disposed over an entirety of the exposed surfaces of the electronic material to prevent diffusion of water past the encapsulating liquid and to protect the electronic material from water. In one aspect, a method of making a liquid-based encapsulation system includes providing an electronic material having a plurality of exposed surfaces; and encapsulating the electronic material with an encapsulating liquid over an entirety of the exposed surfaces of the electronic material to prevent diffusion of water past the encapsulating liquid and to protect the electronic material from water.

A manufacturing method of a substrate structure including vias includes the following steps. A substrate is provided, wherein a material of the substrate includes polyimide. An etching stop layer is formed on the substrate, wherein the etching stop layer covers two opposite surfaces of the substrate. A patterned process is performed on the etching stop layer to form a plurality of openings exposing a part of the substrate. An etching process is performed on the substrate to remove the part of the substrate exposed by the openings and form a plurality of vias.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

Provided is a slot die with variable nozzles. The slot die with variable nozzles, which applies ink on a substrate to perform a coating process, includes: a first body having a cavity configured to accommodate ink supplied from the outside; a second body spaced apart from the first body in a transfer direction of a substrate or a direction opposite to the transfer direction; a shim plate coupled between the first body and the second body and having an discharge port configured to communicate with the cavity and discharge ink accommodated in the cavity toward the substrate; and a plurality of variable nozzles disposed at a lower end of the first body or the second body in a width direction of the substrate so as to be adjacent to the discharge port, wherein each of the plurality of variable nozzles is independently driven according to a state of the ink coated on the substrate and adjusts a partial discharge amount of the ink discharged from the discharge port by changing a partial area of the discharge port at an arrangement position thereof.

To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.

A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

A composition effective for removing contaminates from an electronic device either as a concentrated material or when diluted with water. The composition designed for effective removal of undesirable contaminates from an electronic device, including but not limited to, solder flux and polymeric residues. The composition contains butylpyrrolidone and an alkali and has a pH of greater than 7.1 and a pKa less than 12. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.