A method of delamination of a printed circuit board includes comminuting the printed circuit board, and soaking the comminuted PCB in a solvent system comprising at least two solvents. Once soaking has been completed the method includes separating solids, and electrostatically separating different specific solids from the separated solids.

The present invention relates to a metal oxide nanoparticle ink composition, a method of producing the same, and a method of forming a conductive layer pattern by using the metal oxide nanoparticle ink composition, and more particularly, to a metal oxide nanoparticle ink composition for forming a conductive layer by irradiating an ink composition thin film containing nickel oxide nanoparticles with a sintering laser, a method of producing the same, and a method of forming a conductive layer pattern by using the metal oxide nanoparticle ink composition.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

The stretchable circuit board (100) includes: a stretchable base (10); a stretchable wiring portion (20) formed on the stretchable base (10); a reinforcement base (30) having in-plane rigidity higher than that of the stretchable base (10); a draw-out wiring portion (40) formed on the reinforcement base (30), and electrically continuous with the stretchable wiring portion (20); and an elastomer layer (50) formed on the reinforcement base (30). The reinforcement base (30) overlaps with a partial area (10a) of the stretchable base (10). An other area (10b) of the stretchable base (10) is exposed from the reinforcement base (30). The stretchable wiring portion (20) extends on the other area (10b) and over the partial area (10a). The elastomer layer (50) and the stretchable base (10) are layered and joined with each other.

A composition effective for removing contaminates from an electronic device either as a concentrated material or when diluted with water. The composition designed for effective removal of undesirable contaminates from an electronic device, including but not limited to, solder flux and polymeric residues. The composition contains butylpyrrolidone and an alkali and has a pH of greater than 7.1 and a pKa less than 12. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.

Disclosed herein are solvent compositions and methods of using the solvent compositions. The solvent composition includes at least trans-1,2-dichloroethylene (t-DCE) and 1,1,2,2-tetrafluoroethyl-2,2,3,3-tetrafluoropropyl ether (TFE-TFPE). The solvent composition may also include an oxygenated solvent, such as an alcohol or fluorinated ether. A method of cleaning the surface of an article includes contacting the surface with the solvent composition to dissolve, disperse, or displace a contaminant on the surface, and removing the solvent composition containing the contaminant from the surface.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.

A method of manufacturing a component carrier is described. The method includes forming a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and reducing an amount of solvent in a fiber-free dielectric layer, which is directly connected to a metal layer, so that the dielectric layer with reduced amount of solvent remains at least partially uncured.

A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.