A method for manufacturing a wiring substrate includes forming conductor pads on a surface of an insulating layer, positioning, on or in the insulating layer, an electronic component having electrode pads, forming a second insulating layer covering the surface of the insulating layer, conductor pads and electronic component, forming first via holes exposing the conductor pads, applying a first desmear treatment to the second insulating layer such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the electrode pads of the electronic component positioned on or in the insulating layer, applying a second desmear treatment to the second insulating layer such that residues are removed from the second via holes, forming first via conductors in the first via holes, and forming second via conductors in the second via holes.

A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel.

The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.

A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.

A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

Depicted embodiments are directed to an Application Specific Electronics Packaging (ASEP) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the batch processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

The invention relates to a laser printing method that includes the following steps: (a) the provision of a receiver substrate (4); (b) the provision of a target substrate (5) comprising a transparent substrate (50) one surface of which has a coating has a coating (51) constituted of a solid metal film; (c) the localised irradiation of the said film (51) through the said transparent substrate (50) by means of a first laser (6) in order to reach the melting temperature of the metal in a target zone of the said film which is in liquid form; (d) the irradiation of the said liquid film through the said transparent substrate by means of a second laser on the said target zone defined in the step (c), in order to form a liquid jet in the said target zone and bring about the ejection thereof from the substrate in the form of molten metal; (e) the depositing on the receiver substrate of a molten metal drop over a defined receiving zone, with the said drop solidifying upon cooling.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Printing apparatus includes a donor supply assembly, which positions a transparent donor substrate having opposing first and second surfaces and a donor film formed on the second surface so that the donor film is in proximity to a target area on an acceptor substrate. An optical assembly directs one or more beams of laser radiation to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate. Means are provided to mitigate or compensate for the variation in reflection of the laser radiation across an area of the donor substrate, so as to equalize a flux of the laser radiation that is absorbed in the donor film across the area of the donor substrate.

A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.