Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.

A liquid metal-based flexible electron device and a preparation method are disclosed. In the method, 3D printing and the characteristic that ABS plastic can be dissolved by acetone are utilized, and a microchannel is quickly constructed in the flexible substrate of Ecoflex, and liquid metal is then injected into the microchannel to complete the manufacturing of a flexible electronic device. The gold film on the surface of ABS is transferred to the surface of the flexible Ecoflex substrate.

Flexible lighting panel includes a substrate with a conductor pattern and apertures, solid-state light emitters electrically connected to the conductor pattern, a light-transmissive first protective layer covering at least a portion of a first surface of the substrate, and a second protective layer covering at least a portion of a second surface of the substrate. The first and second protective layers are joined to one another through the apertures and the periphery of the substrate to assist in maintaining the light-transmissive first protective layer and the second protective layer against the first and second surfaces of the substrate, respectively. One or both of the first and second protective layers encapsulate the solid-state light emitters. The lighting panel is flexible to allow opposite edges of the lighting panel to be folded over on one another and/or the lighting panel to be rolled into a tubular configuration.

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.

A device comprises a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member comprises, as a base thereof, a first film formed of a film and comprises a conductive portion made of conductor. The device is formed with a closed space. The closed space is enclosed by the first sealing member and the second sealing member and is shut off from an outer space located outside the device. The first circuit member and the second circuit member are shut in the closed space and comprise a first contact point and a second contact point, respectively. At least one of the first circuit member and the second circuit member comprises an electrode. The conductive portion is in contact with the electrode in the closed space and is partially exposed to the outer space located outside the device.

A device comprises a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member basically comprises a first film formed with an opening and comprises a frame film. At least one of the first circuit member and the second circuit member comprises an exposed portion and a seal portion which surrounds the exposed portion. The frame film has a film-seal portion and a circuit-seal portion. The film-seal portion is bonded to the first film to surround the opening. The circuit-seal portion is bonded to the seal portion to surround the exposes portion. The device is formed with a closed space which is enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to the outer space located outside the device.

According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.

An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.