Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.

A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

A direct view display device includes a printed circuit board, an array of pixels located on a first side of the printed circuit board, each pixel including a plurality of light emitting diodes, and an isolation grid comprising a light absorbing material located between the pixels in the array of pixels.

Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 10.sup.10Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 10.sup.6Ω.

The disclosure relates to an electronic unit with a circuit board having at least one component arranged on a main surface of the circuit board and a casing element, which incorporates the at least one component, as well as with an ESD protection arrangement for the circuit board. According to the disclosure, open areas on the circuit board, which are not covered by the casing element, are covered with a gold layer directly mounted on a copper surface of the circuit board.

One general aspect of the present disclosure includes an electrical circuit with a circuit carrier, at least one electrical component arranged on the circuit carrier, and at least one data transmission device with an antenna section. The data transmission device may be configured for wireless transmission of data and may include a housing, where the at least one electrical component, the at least one data transmission device, and at least one section of the circuit carrier are at least partially enclosed by the housing. At least the antenna section of the data transmission device may be arranged in a transmission range inside the housing and the transmission range may be spaced at a distance from the circuit carrier.

A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.

A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.