Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.

A method of manufacturing a component carrier includes: (i) embedding at least one carrier plate in a core; (ii) forming a stack on the at least one carrier plate, wherein the stack comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (iii) thereafter removing the at least one carrier plate from the stack. A corresponding hybrid core and a corresponding semi-finished product each comprise analogous features.

A circuit board with circuit components mounted thereon is integrally molded with a sealing resin having a sealed end face part that is a thermosetting resin. A cylindrical intermediate adapter is bonded and fixed to the sealed end face part with an opening into which a receptacle body of a connector housing is inserted. A resilient contact connected to a lead wire is caused to be in electrical contact with a copper foil trace terminal of the circuit board. The connector housing and the intermediate adapter are made of a thermoplastic resin resistant to crack failure, which improves handling capability for inserting and withdrawing a connector.

An extensible flexible printed circuit board sets one or a plurality of flexible printed circuit boards each including a plurality of conductive layers and an insulting layer as a base circuit board, and includes: component mounting partners which are provided at least at parts of the base circuit board, and capable of mounting electronic components an extensible conductive part which is provided at least at a part of the base circuit board includes a plurality of joint parts each intersecting a center line in an extension/contraction direction and a plurality of curved parts each continuing from an end part of each joint part and curve, and exhibits extensibility by the curved parts curving to open or close; and a covering member whose material is a flexibly deformable elastomer, and which covers the component mounting parts and the extensible conductive part.

An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

The disclosed wearable devices may include a wearable body sized and configured to be worn on a user's body part and at least one electronic component within the wearable body. The wearable body may include a flexible material for wrapping at least partially around the user's body part. The at least one electronic component may be overmolded within the flexible material of the wearable body. Various other methods, systems, and devices are also disclosed.

A compliant electronic device is presented. The device may be, for example a wearable display for sports applications. The compliant electronic device comprises a thin sheet with a regular pattern of openings optimized to provide maximum compliance. The device may be partially or completely embedded in foam or other highly stretchable and compressible material that, while preserving compliance, protects the device from untoward environmental influences.

Through the use of a method of producing electronic components, a plurality of electronic components are obtained by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components. The method of producing electronic components includes: a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therewith, the first circuit board being provided with a filled via around a mounting region of the circuit components; a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with insulating resins; and a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components.

A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.