Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.

Systems and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes calibrating flow rate of a material through a coating system. A target flow rate for the material through a spray nozzle is received, a first operating pressure of the coating system based upon the target flow rate is calculated, and the material is ejected onto a least part of a surface with the material flowing through the spray nozzle at the first operating pressure of the coating system. Subsequent to a comparison between an operating flow rate and the target flow rate, the operating pressure is adjusted to a second operating pressure and at least part of the substrate is sprayed with the material flowing through the spray nozzle at the second operating pressure of the coating system.

A method to fabricate a tamper respondent assembly is provided. The tamper respondent assembly includes an electronic component and an enclosure at least partly enclosing the electronic component. A piezoelectric sensor is integrated in the enclosure. The integrating includes providing a base structure that includes a first conductive layer, depositing a piezoelectric layer on the first conductive layer, covering the piezoelectric layer with a second conductive layer, and providing sensing circuitry for observing sensing signals of the piezoelectric layer. The piezoelectric layer includes a plurality of nanorods. Aspects of the invention further relates to a corresponding assembly and a corresponding computer program product.

One aspect relates to a process for producing an electrical medical implant, comprising the following steps: a. providing an electrical feedthrough, which comprises a substrate, an electrical component, and a contact element; b. coating the electrical component with a layer.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.

A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate.

An apparatus is provided which comprises: a woven fiber layer, a first resin layer on a first surface of the woven fiber layer, a second resin layer on a second surface of the woven fiber layer, the second surface opposite the first surface, and the first and the second resin layers comprising cured resin, a third resin layer on the first resin layer, and a fourth resin layer on the second resin layer, the third and the fourth resin layers comprising an uncured resin, and wherein the fourth resin layer has a thickness greater than a thickness of the third resin layer. Other embodiments are also disclosed and claimed.

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.