The according to an embodiment includes a substrate, a transistor disposed on the substrate, a light-emitting device electrically connected to the transistor, an encapsulation layer disposed on the light-emitting device, a partition wall disposed on the encapsulation layer and including an opening overlapping the light-emitting device, and a color converting layer, a low-refractive index layer, and a color filter sequentially stacked on each other in the opening.

A method of manufacturing a display panel includes preparing a substrate including a first area, a second area surrounding the first area, and a third area disposed between the first area and the second area, forming a first organic insulating layer in the third area, forming a metal material layer in the third area on the first organic insulating layer, forming a mask layer on the metal material layer, the mask layer comprising a first portion and a second portion spaced apart from each other, removing the metal material layer and the first organic insulating layer exposed by the mask layer by using the mask layer as a mask, and forming a light-emitting diode in the second area.

A display device includes: a substrate; a semiconductor on the substrate, and including a channel, a first region, and a second region; an auxiliary insulating layer on the semiconductor; a first auxiliary electrode on the auxiliary insulating layer, and overlapping with the first region of the semiconductor; a second auxiliary electrode on the auxiliary insulating layer, and overlapping with the second region of the semiconductor; a gate electrode on the auxiliary insulating layer, and overlapping with the channel of the semiconductor; a first electrode on the first auxiliary electrode, and connected to the first region of the semiconductor; and a second electrode on the second auxiliary electrode, and connected to the second region of the semiconductor.

A display device including a first substrate, an organic light emitting layer on the first substrate and including a protrusion, and a pixel circuit including a passivation film having a recess engaged with the protrusion, wherein the protrusion is located at a position corresponding to the recess and adhered to the pixel circuit in the recess by a conductive adhesive.

An organic light-emitting display device having an integrated thin-film solar cell includes a substrate, a display disposed in a first area on the substrate to display images and including a first thin-film layer, and a thin-film solar cell disposed in a second area on the substrate to receive sunlight and generate electricity to drive the display and including a second thin-film layer, in which the first thin-film layer and the second thin-film layer include the same thin-film layer extending from the first area to the second area.

A flexible organic light-emitting diode (OLED) substrate includes a flexible substrate, an inorganic barrier layer, an OLED device, and an adhesive-filling layer. The inorganic barrier layer is disposed on the flexible substrate. The OLED device is disposed on the inorganic barrier layer. The adhesive-filling layer covers the OLED device and the inorganic barrier layer. The flexible substrate further comprises a base substrate, a bending portion, and a covering portion. A thin film transistor layer is disposed on the base substrate, and the bending portion is connected to the base substrate and the covering portion. The covering portion covers the adhesive-filling layer and is stacked above the base substrate.

An embodiment of the application discloses a display panel motherboard and a method for manufacturing a display panel. The display panel motherboard includes a plurality of panel areas and a cutting area located between the panel areas. The display panel motherboard further includes a substrate, a display function layer, a peeling film layer, and an encapsulation layer. In particular, the display function layer is disposed on the substrate and includes a plurality of display unit sections, of which one display unit section is formed within one panel area. The peeling film layer is located within the cutting area.

The present disclosure relates to a display device comprising a substrate including a plurality of sub-pixels, a thin film transistor and a light emitting element on the substrate, an encapsulation layer on the substrate and covering the light emitting element, and a light control layer disposed on the light emitting element and including a liquid crystal monomer and a dichroic dye. The dichroic dye in a boundary region between the sub-pixels has a black color to absorb a light.

A display device includes including emission areas, a non-emission area. Light emitting elements are disposed on a substrate in the emission areas. A bank is disposed on the substrate in the non-emission area of the substrate and includes openings corresponding to the emission areas. Color conversion patterns are disposed in the openings of the bank and converts a wavelength band of light incident from the light emitting elements to emit light. Organic patterns are disposed on the color conversion patterns and are separated from each other. Color filters are disposed on the organic patterns. The color filters are sequentially stacked in a space between the organic patterns in the non-emission area.

An organic light emitting diode display device and a method for manufacturing the same are disclosed. The organic light emitting diode display device includes: a substrate having first and second subpixels, each of the first and second subpixels having an emission area; a thin film transistor in each of the first and second subpixels; a first anode connected to the thin film transistor and having a first area; and a second anode having a second area greater than the first area, wherein the second anode is disposed on the first anode to cover the first anode.