A fingerprint identification device, a display panel, a fabrication method thereof, and a display device are disclosed. The fingerprint identification device includes a fingerprint sensor, an aperture diaphragm, and a first shielding structure. The fingerprint sensor includes a plurality of sensing units; the aperture diaphragm is on a light incident side of the fingerprint sensor and includes an aperture through which light is allowed to be incident on at least one sensing unit of the fingerprint sensor; and the first shielding structure is on a side of the aperture diaphragm facing away from the fingerprint sensor, and surrounds at least a portion of the aperture.

A display apparatus includes a substrate having a first area, a second area, and a bending area disposed therebetween. The substrate is bent at the bending area about a bending axis. An inorganic insulating layer is disposed over the substrate and includes an opening or groove corresponding to the bending area. An organic material layer fills the opening or groove. A first conductive layer extends from the first area to the second area through the bending area. The first conductive layer is disposed over the organic material layer and includes a multipath portion having a plurality of through holes. A length of the multipath portion, in a direction from the first area to the second area, is greater than a width of the opening or groove, in the direction from the first area to the second area.

A flexible display panel may include a flexible base substrate. The flexible base substrate may include a bendable region (2). The flexible display panel may further include a first layer on the flexible base substrate; a trench (26) penetrating at least part of the first layer; a second layer (14) in the trench; and a metal layer (24) on the second layer. The second layer may have a smaller elastic modulus than the first layer. At least part of the second layer and the metal layer may be conformal with the bendable region during bending of the bendable region.

Disclosed herein is an apparatus comprising: a pixel define layer (PDL) on a support and having a hole therein; a light emitting layer (EML) at least partially within the hole; and a first reflective layer on a sidewall of the hole and configured to reflect light emitted by the EML. Also disclosed herein is a display panel and a system comprising a plurality of the apparatus. Further disclosed herein is a method of making the apparatus.

The present invention provides a display panel and a manufacturing method thereof. The display panel includes a flexible substrate, a buffer layer, a combination insulation layer, recess, an organic insulation layer, and a first wire changing layer. The first wire changing layer is disposed on an upper surface of the organic insulation layer and extends to the combination insulation layer. The present invention removes a through hole in a conventional organic insulation layer, on one hand mitigates the issue of broken lines in the first wire changing layer, and on the other hand mitigates the issue of shorting of adjacent two of wires in the first wire changing layer because of square waveform, sawtooth waveform, triangular waveform, and sinusoidal waveform of an edge line on a side of the first wire changing layer such that stability of the display panel is improved.

The present application provides a touch display panel, because a plurality of touch units is disposed between a first pixel defining layer and a second pixel defining layer, and/or, the plurality of touch units is disposed between the second pixel defining layer and an encapsulation layer, thereby making a thickness of the touch display panel be thinner.

The present disclosure provides an OLED display panel which includes a substrate, a drive circuit layer, a light-emitting functional layer, and a pixel definition layer. The light-emitting functional layer includes a light-emitting area and a non-light-emitting area. The drive circuit layer includes a buffer layer, a first electrode plate, and a second electrode plate, and the first electrode plate and the second electrode plate form a storage capacitor. It solves the technical problem of current OLED display panels having dark stripes by not depositing the first electrode plate when silicon nitride is deposited to form a first buffer layer which prevents ionic gases produced when silicon nitride is deposited from having a reduction reaction with the first electrode plate.

A display device includes a display member including a substrate and a plurality of light-emitting elements disposed on the substrate, a sensing member disposed on the display member, and a polarizing member disposed on the sensing member. The sensing member includes a sensing insulating layer and a sensing conductive layer disposed on the sensing insulating layer. The polarizing member includes a polarizing layer and a polarizing adhesive layer disposed between the polarizing layer and the sensing conductive layer. The polarizing adhesive layer is in contact with the sensing conductive layer.

An OLED display panel and the method for manufacturing the same are disclosed in the present invention. The OLED display panel includes an organic film layer, an array layer, an organic light emitting layer, and a package layer disposed on the organic light emitting layer, which are stacked in layers. The organic film layer is provided with a first opening, which is filled with a light-transmitting material to form a light transmission layer. An electronic component area is disposed on one side of the organic film layer away from the package layer and is corresponding to the light transmission layer.

An active device substrate includes a substrate, a silicon layer, a first insulating layer, a first gate, a first dielectric layer, a first transfer electrode, a second transfer electrode, and a second dielectric layer. Two openings penetrate through the first dielectric layer and overlap the silicon layer. The first transfer electrode and the second transfer electrode are respectively located in the two openings. The second dielectric layer is located on the first transfer electrode and the second transfer electrode. Two first through-holes penetrate through the second dielectric layer. The first transfer electrode and the second transfer electrode are etch stop layers of the two first through-holes.