A monolithic Light Emitting Diode (LED) micro-display contains one or more modular LED arrays. The LED array uses quantum dot light conversion technology or Organic Light Emitting Diode (OLED). The micro-display has a spacing-saving topology and a direct current driver architecture. Its modular design is scalable, which allows manufacturing micro-displays of various sizes using the same module.

A manufacturing method of an array substrate includes forming a plurality of bonding pads in a bonding region of a base substrate, and forming at least one insulating support part at at least one position where the plurality of bonding pads are not provided in the bonding region of the base substrate.

A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.

A driving chip includes a body portion including a circuit. A first bump is electrically connected to the body portion. A second bump is disposed on the first bump. The second bump has a planar area less than a planar area of the first bump on a plane defined along a first direction parallel to an upper surface of the body portion. The first bump has a length of about 60 m or more in the first direction, a side surface of the second bump is aligned with a side surface of the first bump along a second direction orthogonal to the first direction.

A display (100) comprising a plurality of LED chips (604), each LED chip (604) comprising a plurality of light emitting elements (606a-c). Each LED chip (604) is arranged such that a first light emitting element (606a) is configured to illuminate a sub-pixel, and a second light emitting element (606b) is configured to illuminate a sub-pixel using substantially the same wavelength of light as the first light emitting element. There is also described an LED chip, a display pixel, a controlling method, a computer device and a computer program for a display.

A film element for driving a display device and a display device using the same are disclosed. The film element includes a film substrate including wirings and pads connected to the wirings, and an IC chip mounted on the film substrate to be connected to the wirings. The pads on the film substrate are grouped into a plurality of areas having different thermal correction amounts. Pads in a second area are closer to the IC chip than pads in a first area. A length of the first area is set to a length obtained by subtracting a first thermal correction amount from a first reference length. A length of the second area is set to a length obtained by subtracting a second thermal correction amount from a second reference length. The second thermal correction amount is smaller than the first thermal correction amount or has a negative value.

A display panel of an active matrix organic light emitting diode (AMOLED) includes a first region and a second region arranged on at least one side of the first region. A plurality of switch units are arranged in the first region. A driving circuit is arranged in the second region. A light-emitting device array is arranged and corresponds to the switch units, and is arranged in the first region and the second region. The light-emitting device array in the second region is configured to cover a driving circuit.

A display device includes a substrate having flexibility, a display region including a plurality of pixels above the substrate, a periphery region on an outer side of the display region above the substrate, a first wiring arranged in the periphery region and extending in a first direction, a first insulation layer above the first wiring, and a second wiring extending in a second direction intersecting the first direction above the first insulation layer, wherein the first wiring includes a first bent part, the second wiring includes a second bent part, and the first bent part overlaps the second wiring and the second bent part overlaps the first wiring in a region where the first wiring and the second wiring intersect.

A pixel array includes a display medium module, an active switching element, and a connecting module. Each display medium module includes two pairs of electrodes and a display medium. Each pair of electrodes has a first electrode and a second electrode. The display medium is disposed between first electrodes and second electrodes. The active switching element is electrically connected to the first electrodes for allowing the first electrodes and the second electrodes to change a state of the display medium. The connecting module is integrated with the display medium module to electrically connect the active switching element to the first electrodes via conductors of the connecting module.

A tiled electronic system is disclosed, which includes: a plurality of electronic units including a first electronic unit and a second electronic unit, wherein the second electronic unit is separated from the first electronic unit by a distance in a first direction, wherein the distance is conformed to the following equation (I):

[00001]$\begin{array}{cc}d8.75{10}^{-5}W.Math..Math.1\sqrt{\frac{W.Math..Math.1^2}{\left(W.Math..Math.1^2+W.Math..Math.2^2\right)}}& \left(I\right)\end{array}$

wherein d is the distance, W1 is a width of the first electronic unit in the first direction, and W2 is a width of the first electronic unit in a second direction perpendicular to the first direction.