Patent classifications
H10K59/873
DISPLAY DEVICE
A display device includes a display panel, a sensing layer disposed on the display panel and including a fingerprint sensor, an optical layer disposed on the display panel, and a cover layer disposed on the optical layer, wherein the cover layer is a multilayer structure.
MANUFACTURING METHOD OF COVER WINDOW FOR FLEXIBLE DISPLAY DEVICE AND MANUFACTURING METHOD OF FLEXIBLE DISPLAY DEVICE
A manufacturing method of a cover window of a flexible display device includes attaching a glass substrate to a jig including a hinge. The jig and the glass substrate are folded around the hinge. The glass substrate is immersed in an etchant to etch the glass substrate.
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
A display device includes: a substrate; a display area on the substrate, where the display area includes a plurality of pixels; a peripheral area on the substrate, where the peripheral area is on a periphery of the display area; a first protective layer on the substrate, where the first protective layer is in the display area and the peripheral area; and a second protective layer on the substrate, where the second protective layer is in the display area and the peripheral area. The first protective layer and the second protective layer overlap each other.
DISPLAY APPARATUS AND METHOD OF PROVIDING THE SAME
A display apparatus includes a light-emitting element, an encapsulation layer covering the light-emitting element, a bank on the encapsulation layer and including an opening corresponding to the light-emitting element, and a quantum-dot layer in the opening of the bank. Roughness of a lower surface of the quantum-dot layer which is closest to the encapsulation layer is different from roughness of an upper surface of the quantum-dot layer which is furthest from the encapsulation layer.
DISPLAY DEVICE INCLUDING A LIGHT BLOCKING PATTERN
A display device includes first and second areas. The second area includes a display panel including a plurality of light emitting areas respectively overlapping element areas and a non-light-emitting area at least partially surrounding the light emitting areas such that at least a portion of the non-light-emitting area overlaps a peripheral area. A lower cover layer is disposed on the display panel, overlapping the first area and the second area, and including cover patterns respectively overlapping the light emitting areas of the second area. A light blocking pattern is disposed on the lower cover layer overlapping the second area. The light blocking pattern covers a portion of an upper surface of each of the cover patterns.
SILICON-BASED MICRO DISPLAY SCREEN AND METHOD FOR MANUFACTURING THE SAME
The present invention provides a silicon-based micro display screen and method for manufacturing the same. The method includes following steps: providing a silicon substrate, defining a number of sub-pixel regions on the silicon substrate, and sequentially and respectively preparing an anode layer, an OLED layer, a cathode layer and a first protective layer in each sub-pixel region on the silicon substrate; plasma bombarding and removing the exposed OLED layer; forming a second protective layer on sides of the etched cathode layer, the protective layer and the OLED layer; sequentially performing other sub-pixels; and processing and forming a silicon-based micro-display screen based on the results of the above steps. In present invention, the etching and coating processes are carried out in a vacuum environment to prevent the OLED layer from being invaded by water vapor and oxygen, and prolong the service life of the silicon-based micro display screen.
DISPLAY PANEL AND METHOD FOR MANUFACTURING THEREOF
The present application provides a display panel and a method for manufacturing the display panel. The display panel includes a substrate, at least one raised structure, a film encapsulation layer, and a planarization layer. The raised structure is disposed on the substrate. The film encapsulation layer covers the substrate, the raised structure, and a space sidewall of the space. The planarization layer is disposed on the film encapsulation layer. The planarization layer includes hexamethyldisiloxane.
DISPLAY TERMINAL AND DISPLAY PANEL APPLIED IN DISPLAY TERMINAL
A display terminal and a display panel applied in the display terminal are disclosed in the present application. Widths of the non-display areas of the display panel are elongated to fix the non-display areas to a non-display surface of the display terminal, to achieve a bezel-free display effect on two sides of the display terminal in an unfolded state, and a seamless surround display effect and a bezel-free display effect on the two sides of the display terminal in a folded state.
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
A display device includes a base member, a thin film transistor, an organic insulation film, a light-emitting layer, and a sealing layer. The display device has an active area and a non-active area. The non-active area includes a notched portion and a protrusion portion surrounding the notched portion and having, on a notched portion side, a side face including a reverse-tapered face. The light-emitting layer is disconnected as a result of a step at the protrusion portion. A filling material is embedded in at least a part of a space located between the reverse-tapered face and a top face of the organic insulation film. The top face overlaps the reverse-tapered face in a plan view.
DISPLAY PANEL AND DISPLAY DEVICE
A display panel and a display device are provided. An adhesive layer is disposed between an organic layer and an inorganic layer in a bonding area of the display panel, where a surface roughness of an adhesive layer material is greater than a surface roughness of an organic layer material and a surface roughness of an inorganic layer material. In addition, a plurality of concave-convex structures can be provided on a surface of the organic layer and/or a surface of the inorganic layer in contact with the adhesive layer to enhance interface bonding force. This can alleviate a problem that film layers are prone to peeling off when a flexible printed circuit (FPC) is bonded to the display panel in the prior art.