A display device includes a first glass substrate including a first side surface which is partially inclined, a second glass substrate including a second side surface which is partially inclined, the second glass substrate being apart from the first glass substrate, a display layer including a first area on the first glass substrate, a light-emitting device in the first area, a bending area extending from the first area, and a second area extending from the bending area and on the second glass substrate, and an encapsulation layer on the display layer, the encapsulation layer including an inorganic encapsulation layer and an organic encapsulation layer. Each of the first side surface and the second side surface is adjacent to the bending area.

Encapsulation materials for light-emitting elements such as organic light-emitting diodes and polymer light-emitting diodes are implemented as a photopolymerizable hydrophobic fluid dispersion polymer having both adhesive and barrier properties. A light-emitting element encapsulation is formed by applying the photopolymerizable hydrophobic fluid dispersion polymer of the present invention to a manufactured light-emitting element and photocuring. An encapsulation structure may be formed in a short time through a simple coating (or filling) process and a curing process by exposure (UV, or the like), and thus an encapsulation of a light-emitting device (particularly, a large-area organic light-emitting diode) is possible at low cost without using expensive deposition equipment.

A display substrate includes a backplane, first light-emitting devices capable of emitting first color light, second light-emitting devices capable of emitting second color light that are all disposed on the backplane, a low-refractive-index intercalation layer disposed at a side, away from the backplane, of the first light-emitting devices and the second light-emitting devices, and an encapsulation layer. The encapsulation layer includes a first inorganic barrier layer, a first organic barrier layer and a second inorganic barrier layer that are sequentially stacked on a side of the low-refractive-index intercalation layer away from the backplane. A refractive index of the low-refractive-index intercalation layer is less than a refractive index of the first inorganic barrier layer. In a direction perpendicular to the backplane, a transmittance of the low-refractive-index intercalation layer to the first color light is less than a transmittance of the low-refractive-index intercalation layer to the second color light.

A display apparatus includes a substrate, a thin-film transistor, an insulating material stack, and a first dam structure. The substrate includes a display area and a peripheral area located outside the display area. The thin-film transistor layer overlaps the substrate. The insulating material stack overlaps the peripheral area. The first dam structure overlaps the substrate, is located closer to the display area than the insulating material stack, partially covers the insulating material stack, and reaches farther than the insulating material stack with reference to the substrate.

A display device may include a transistor substrate including a driving element, and having a display area, and a non-display area surrounding the display area, a bank layer on the non-display area of the transistor substrate, and exposing an outer area of the non-display area of the transistor substrate that is opposite to the display area, an inorganic insulating layer covering an upper surface of the bank layer, a side surface of the bank layer, and the outer area of the transistor substrate, a low refractive layer on the inorganic insulating layer, and a first color filter layer on the non-display area to cover a portion of an upper surface of the inorganic insulating layer, and a side surface of the inorganic insulating layer.

An organic light emitting diode which suppresses external light reflection while reducing loss of light generated in an organic light emitting layer is disclosed. An organic light emitting diode includes a substrate, an anode on the substrate, a bank on the anode and exposing a part of the anode to define an emission area, an organic light emitting layer on the emission area and the bank, a cathode on the organic light emitting layer, a plurality of light shielding patterns on the cathode and overlapping the bank, and a light loss inducing layer located on a same plane as the plurality of light shielding patterns and disposed between a pair of light shielding patterns from the plurality of light shielding patterns, the light loss inducing layer having has a same thickness as a thickness of that of the plurality of light shielding patterns, and overlaps the emission area.

A display device includes: a display panel comprising light emitting areas and a non-light-emitting area adjacent to the light emitting areas; an input sensor on the display panel; and a reflective control layer on the input sensor, the display panel including: a light emitting element; a capping layer on the light emitting element; a pattern layer directly on the capping layer and comprising a plurality of protrusions spaced apart from each other; and an encapsulation layer on the pattern layer, wherein each of the protrusions does not overlap the light emitting areas and overlaps the non-light-emitting area.

Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

The present application provides a display panel, a display module, and a display device. A flexible substrate of the display panel includes a first flexible substrate and a second flexible substrate, and the first flexible substrate is provided with a first through-hole corresponding to a lighting path of an electronic component. Based on the first through-hole, light transmittance of the display panel is increased, so that electronic components such as a camera can be disposed below the display panel, and a narrow bezel design is realized.

A method of manufacturing a display panel includes fabricating a display portion on a glass substrate; forming a barrier layer on the glass substrate outside the display portion; forming an encapsulation film on the barrier layer and the display portion; and obtaining a panel area by removing the barrier layer and the encapsulation film outside a predetermined limited area on the glass substrate. The predetermined limited area corresponds to the display portion.