A method for producing ultrahigh resolution (for example, 800˜4000 Pixel Per Inch, PPI) Organic Light Emitting Diode (OLED) displays, with the following characteristics: S1, on top of the driving backplane, deposit the first electrode with designed spacing between one another. After that the Pixel Defining Layer (PDL) is deposited and patterned based on the designs of subpixels of the display; S2, on top of the defined subpixel regions from S1, deposit OLED devices, then fabricate the second electrode with the protection layer; S3, on top of the described second electrode with protection layer, deposit the third electrode. The present invention discloses the patterning method to produce OLED devices without using the conventional Metal Masks. Instead, an ultra-thin organic mask is fabricated using the special photolithographic process, and the OLED device structure that include the protection layer to prevent damages to the OLED device from the chemicals used during the processes.

The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.

There is provided a display substrate, a manufacturing method thereof, and a display device, relating to the field of display technology. The display substrate includes: a base substrate; a self-luminescent layer disposed on a side of the base substrate; and an encapsulation film layer disposed on a side of the self-luminescent layer away from the base substrate. The display substrate has a gap, which penetrates through the self-luminescent layer and the encapsulation film layer, and separates the self-luminescent layer and the encapsulation film layer into at least two parts with a part corresponding to a to-be-perforated area of the display substrate and another part corresponds to a non-perforated area of the display substrate other than the to-be-perforated area. The edge of the encapsulation film layer adjacent to the gap covers the side surface of the edge of the self-luminescent layer adjacent to the gap.

Embodiments described herein relate to graded slope bottom reflective electrode layer structures for top-emitting organic light-emitting diode (OLED) display pixels. An EL device includes a pixel definition layer having a top surface, a bottom surface, and graded sidewalls interconnecting the top and bottom surfaces and a bottom reflective electrode layer disposed over the pixel definition layer. The bottom reflective electrode layer includes a planar electrode portion disposed over the bottom surface and a graded reflective portion disposed over the graded sidewalls, where the graded reflective portion has a concave profile. The EL device includes an organic layer disposed over the bottom reflective electrode layer and a top electrode disposed over the organic layer. Also described herein are methods for fabricating the EL device.

An organic light-emitting display apparatus including a first electrode disposed on a substrate; a pixel defining layer covering an edge of the first electrode; a layer disposed on the pixel defining layer, the layer including a fluoropolymer and contacting a top surface of the first electrode; a first organic functional layer including a first light emitting layer, the first organic functional layer having a lower surface contacting the top surface of the first electrode; and a second electrode disposed on the first organic functional layer.

The present invention discloses a patterned perovskite film, a preparation method thereof, and a display device. The method includes mixing a perovskite precursor and a photo-initiated polymer monomer, and realizing polymerization of a part of a predetermined area under shielding of a photomask, that is, the formed perovskite crystals are encapsulated by the formed polymer with formation of the patterned perovskite film.

A display apparatus includes a substrate, a pixel circuit layer having at least one thin-film transistor on the substrate, a first layer disposed on the pixel circuit layer and having a first opening, and a display element disposed in the first opening and including a first electrode, an emission layer, and a second electrode, which are sequentially stacked. The first electrode extends from an inner surface of the first layer defining the first opening along an upper surface of the first layer, and the emission layer extends on the first electrode along the inner surface of the first layer.

A shadow mask for patterned vapor deposition of an organic light-emitting diode (OLED) material includes a ceramic membrane under tensile stress with a plurality of through-apertures forming an aperture array through which a vaporized deposition material can pass. A multilayer peripheral support is attached to a rear surface with a hollow portion beneath the aperture array. A compressively-stressed interlayer balances the tensile stress of the ceramic membrane. A shadow mask module with multiple shadow masks is also provided and includes a rigid carrier having plural windows with a shadow mask positioned in each window. To make the module, shadow mask blanks are affixed to each carrier window followed by etching of apertures and support layers. In this way extremely flat masks with precise aperture patterns are formed.

A display apparatus includes a base substrate, a thin film transistor layer on the base substrate, an insulation layer on the thin film transistor layer, a first electrode on the insulation layer and in a light emitting area, a pixel defining layer having an opening that has a size and a shape substantially same as that of the first electrode, and on the insulation layer, a light emitting layer on the first electrode, and a second electrode on the light emitting layer.

Ligand-capped inorganic particles, dispersions of the ligand-capped inorganic particles, and films composed of the ligand-capped inorganic particles are provided. Also provided are methods of patterning the films and electronic, photonic, and optoelectronic devices that incorporate the films. The ligands include bifunctional ligands and two-component ligand systems that include a photosensitive group, cation, or molecule.