A micro electromechanical (mem) device includes a first electrode, a second electrode, and a shaped carbon nanotube with a first end and a second end. The first end of the shaped carbon nanotube is conductively connected to the first electrode and the second end is conductively connected to the second electrode. A system for making the device includes a plurality of electrodes placed outside the growth region of a furnace to produce a controlled, time-varying electric field. A controller for the system is connected to a power supply to deliver controlled voltages to the electrodes to produce the electric field. A mixture of gases is passed through the furnace with the temperature raised to cause chemical vapor deposition (CVD) of carbon on a catalyst. The sequentially time-varying electric field parameterizes a growing nanotube into a predetermined shape.

A method of manufacture and structure for a monolithic single chip single crystal device. The method can include forming a first single crystal epitaxial layer overlying the substrate and forming one or more second single crystal epitaxial layers overlying the first single crystal epitaxial layer. The first single crystal epitaxial layer and the one or more second single crystal epitaxial layers can be processed to form one or more active or passive device components. Through this process, the resulting device includes a monolithic epitaxial stack integrating multiple circuit functions.

Disclosed herein are microelectronic assemblies with integrated perovskite layers, and related devices and methods. For example, in some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, and a perovskite conductive layer on the conductive layer. In some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, a perovskite conductive layer having a first crystalline structure on the conductive layer, and a perovskite dielectric layer having a second crystalline structure on the perovskite conductive layer. In some embodiments, the first and second crystalline structures have a same orientation.

There is provided a DSR speaker comprising at least a central moving element, a plurality of peripheral flexure benders, each flexure bender comprising at least a pair of electrodes and at least a piezoelectric material layer, the flexure benders being connected to said moving element and being configured to move said moving element along an axis perpendicular to a moving element surface, in response to an electrical stimulus applied to said electrodes, in order to produce sound, and at least a mechanical stopper which is configured to limit the motion of said moving element. Various manufacturing methods are also described.

A method of manufacture and structure for a monolithic single chip single crystal device. The method can include forming a first single crystal epitaxial layer overlying the substrate and forming one or more second single crystal epitaxial layers overlying the first single crystal epitaxial layer. The first single crystal epitaxial layer and the one or more second single crystal epitaxial layers can be processed to form one or more active or passive device components. Through this process, the resulting device includes a monolithic epitaxial stack integrating multiple circuit functions.

A single crystal acoustic electronic device. The device has a substrate having a surface region. The device has a first electrode material coupled to a portion of the substrate and a single crystal capacitor dielectric material having a thickness of greater than 0.4 microns and overlying an exposed portion of the surface region and coupled to the first electrode material. In an example, the single crystal capacitor dielectric material is characterized by a dislocation density of less than 10.sup.12 defects/cm.sup.2. A second electrode material is overlying the single crystal capacitor dielectric material.

A method for producing a plurality of piezoelectric ultrasound transducer elements, the method comprising providing or depositing a piezoelectric material on at least part of a surface of a sheet of substrate to form a layered member; and forming the one or more piezoelectric ultrasound transducer elements from the layered member.

There is provided a piezoelectric composite comprising a piezoelectric polymer and particles of a filler dispersed in the polymer, wherein the filler is in micro or nanoparticle form and is present in a filler:polymer weight ratio between about 1:99 and about 95:5. There is also provided an ink and ink cartridge for 3D printing of the piezoelectric composite. There is also provided a piezoelectric 3D printed material comprising the piezoelectric composite and a bifunctional material comprising the piezoelectric composite with one or more conductive electrodes adjacent to the piezoelectric composite. Methods of manufacture and uses thereof are also provided, including methods for 3D printing of a piezoelectric 3D printed material via solvent-cast or FDM 3D printing starting from the piezoelectric composite and/or the ink.

A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.