An ultrasonic transducer may comprise a transducer body including a first face and a second face disposed on opposite sides of the transducer body, wherein the transducer body comprises a piezoelectric material; a first transducer edge disposed on the transducer body; and a second transducer edge disposed on the transducer body, wherein the first edge is disposed on the transducer body substantially opposite from the second edge, and wherein the first and second transducer edges intersect a perimeter of the transducer body, and wherein the first and second edge forms an angle no less than 3 degrees.

A piezoelectric device includes a substrate that is flexible and thermally deformable, and a composite piezoelectric body disposed on the substrate. Output in accordance with deformation of the composite piezoelectric body is obtained. The composite piezoelectric body includes a piezoelectric layer containing an organic binder containing piezoelectric particles, a first electrode layer stacked on a first surface side of the piezoelectric layer, and a second electrode stacked on a second surface side of the piezoelectric layer. The substrate is insert molded and integrated with a molded resin body having a curved shape.

The present invention is directed to a method for manufacturing an ultrasonic fingerprint sensor by using a nanorod structure, the method including: a conductive mold generating step of generating a plurality of rod generation holes; a nanorod generating step of generating nanorods by filling the plurality of rod generation holes with a nano-piezoelectric material; a side electrode generation portion marking step of marking side electrode generation portions; a conductive mold etching step of generating nanorods and side electrodes by performing primary etching on the conductive mold; an insulating material filling step of filling portions with an insulating material; a lower electrode forming step of performing secondary etching and forming lower electrodes; a dummy substrate bonding step of bonding a dummy substrate to a surface on which the lower electrodes are formed; and an upper electrode forming step of removing the conductive substrate base and forming upper electrodes.

Disclosed is a focused ultrasonic piezoelectric actuator having a novel type of piezoelectric device for focusing ultrasonic waves. The focused ultrasonic piezoelectric actuator includes a dome-shaped piezoelectric body for focusing ultrasonic waves and a rim configured to facilitate focusing of ultrasonic waves of the body and injection of the dome-shaped piezoelectric body during a powder injection molding process, remove warpage of the dome-shaped body during a sintering process, and reinforce focusing intensity of the ultrasonic waves. The rim is integrally formed with the body. Accordingly, in the focused ultrasonic piezoelectric actuator, a dome-shaped focused ultrasonic piezoelectric actuator for focusing ultrasonic waves using a thickness vibration mode at a MHz frequency band is easily manufactured by a powder injection molding method, and thus an ultrasonic focusing effect is maximized.

A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

A piezoelectric element includes: a piezoelectric part; a first substrate and a second substrate, provided at both sides of the piezoelectric part, respectively; a first electrode layer, located between the first substrate and the piezoelectric part; and a second electrode layer, located between the electrode substrate and the piezoelectric part, wherein a surface of at least one of the first substrate and the second substrate close to the piezoelectric part is provided with a convex portion.

An ultrasonic transducer may comprise a transducer body including a first face and a second face disposed on opposite sides of the transducer body, wherein the transducer body comprises a piezoelectric material; a first transducer edge disposed on the transducer body; and a second transducer edge disposed on the transducer body, wherein the first edge is disposed on the transducer body substantially opposite from the second edge, and wherein the first and second transducer edges intersect a perimeter of the transducer body, and wherein the first and second edge forms an angle no less than 3 degrees.

The present invention provides a piezoelectric material not containing lead and potassium, showing satisfactory insulation and piezoelectricity, and having a high Curie temperature. The invention relates to a piezoelectric material includes a main component containing a perovskite-type metal oxide represented by Formula (1): (Na.sub.xBa.sub.1-y)(Nb.sub.yTi.sub.1-y)O.sub.3 (wherein, 0.80x0.94 and 0.83y0.94), and an additive component containing at least one element selected from Mn and Ni, wherein the content of the Ni is 0 mol or more and 0.05 mol or less based on 1 mol of the perovskite-type metal oxide, and the content of the Mn is 0 mol or more and 0.005 mol or less based on 1 mol of the perovskite-type metal oxide.

An active acoustic system includes a thin-film sheet having an array of piezoelectric microstructures embossed in the film. Each piezoelectric microstructure may act as a speaker and/or a microphone. A control circuit is configured to individually address the piezoelectric microstructures to provide a separate voltage signal to, or receive a separate voltage signal from, each piezoelectric microstructure.

An active acoustic system includes a thin-film sheet having an array of piezoelectric microstructures embossed in the film. Each piezoelectric microstructure may act as a speaker and/or a microphone. A control circuit is configured to individually address the piezoelectric microstructures to provide a separate voltage signal to, or receive a separate voltage signal from, each piezoelectric microstructure.