A piezoelectric wire of the present invention includes a conductive wire 11 and a polymer piezoelectric layer 12 that coats the conductive wire 11. The polymer piezoelectric layer 12 contains a -phase polyvinylidene fluoride-based copolymer, and the conductive wire 11 has a wire diameter of 1.0 mm or less. The -phase polyvinylidene fluoride-based copolymer is preferably at least one selected from a vinylidene fluoride-trifluoroethylene copolymer and a vinylidene fluoride-tetrafluoroethylene copolymer.

Improvements in ingestible electronics with the capacity to sense physiologic and pathophysiologic states have transformed the standard of care for patients. Yet despite advances in device development, significant risks associated with solid, non-flexible gastrointestinal transiting systems remain. Here, we disclose an ingestible, flexible piezoelectric device that senses mechanical deformation within the gastric cavity. We demonstrate the capabilities of the sensor in both in vitro and ex vivo simulated gastric models, quantified its key behaviors in the GI tract by using computational modeling, and validated its functionality in awake and ambulating swine. Our piezoelectric devices can safely sense mechanical variations and harvest mechanical energy inside the gastrointestinal tract for diagnosing and treating motility disorders and for monitoring ingestion in bariatric applications.

A method of fabricating a microelectronic device comprising providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A piezoelectric cantilever actuator system array prepared by a process comprising the steps of providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A microelectronic device comprising a base, a first anchor coupled to the base, and a first cantilever coupled to the first anchor, wherein the base, the first anchor, and the first cantilever are an integral structure formed from the same substrate material.

The present invention relates to a piezoelectric sensor manufacturing method, and the piezoelectric sensor manufacturing method according to the present invention includes the steps of: forming a mold in the form of a sensor array pattern including a plurality of grooves by etching a semiconductor substrate; injecting and sintering a piezoelectric material in the grooves; forming piezoelectric rods in the form of a sensor array pattern by etching the semiconductor substrate to protrude the piezoelectric material, i.e., etching to protrude a first area at one side of the pattern; forming an insulation layer by filling an insulation material in the semiconductor substrate; flattening the insulation layer until the piezoelectric material is exposed; forming a first electrode on a first surface of the piezoelectric material and the insulation layer; bonding a dummy substrate on the semiconductor substrate on which the first electrode is formed; flattening a second surface of the semiconductor substrate until the piezoelectric material is exposed; forming a second electrode on a second surface of the piezoelectric material; and exposing the first electrode by etching the first area.

A piezoelectric sensor manufacturing method according to the present invention comprises the steps of: forming a mold in the form of a sensor array pattern including a plurality of grooves by etching a base substrate; injecting a piezoelectric material in inner grooves among the plurality of grooves and injecting a conductive material in outer grooves; sintering the injected piezoelectric material and conductive material; forming piezoelectric rods and conductive rods by etching the base substrate to protrude the piezoelectric material and the conductive material; forming an insulation layer by filling an insulation material in the base substrate; flattening the insulation layer until the piezoelectric rods and the conductive rods are exposed; forming a first electrode on a first surface of the piezoelectric material and the conductive material; bonding a dummy substrate on the base substrate on which the first electrode is formed; flattening the base substrate until the piezoelectric rods and the conductive rods are exposed; and forming a second electrode on a second surface of the piezoelectric rods and the conductive rods.

The present invention provides a piezoelectric material not containing lead and potassium, showing satisfactory insulation and piezoelectricity, and having a high Curie temperature. The invention relates to a piezoelectric material includes a main component containing a perovskite-type metal oxide represented by Formula (1): (Na.sub.xBa.sub.1-y)(Nb.sub.yTi.sub.1-y)O.sub.3 (wherein, 0.80?x?0.94 and 0.83?y?0.94), and an additive component containing at least one element selected from Mn and Ni, wherein the content of the Ni is 0 mol or more and 0.05 mol or less based on 1 mol of the perovskite-type metal oxide, and the content of the Mn is 0 mol or more and 0.005 mol or less based on 1 mol of the perovskite-type metal oxide.

The present invention provides a piezoelectric material not containing lead and potassium, showing satisfactory insulation and piezoelectricity, and having a high Curie temperature. The invention relates to a piezoelectric material includes a main component containing a perovskite-type metal oxide represented by Formula (1): (Na.sub.xBa.sub.1-y)(Nb.sub.yTi.sub.1-y)O.sub.3 (wherein, 0.80?x?0.94 and 0.83?y?0.94), and an additive component containing at least one element selected from Mn and Ni, wherein the content of the Ni is 0 mol or more and 0.05 mol or less based on 1 mol of the perovskite-type metal oxide, and the content of the Mn is 0 mol or more and 0.005 mol or less based on 1 mol of the perovskite-type metal oxide.

A piezoelectric element includes: a piezoelectric part; a first substrate and a second substrate, provided at both sides of the piezoelectric part, respectively; a first electrode layer, located between the first substrate and the piezoelectric part; and a second electrode layer, located between the electrode substrate and the piezoelectric part, wherein a surface of at least one of the first substrate and the second substrate close to the piezoelectric part is provided with a convex portion.

The object of the present invention is to provide a laminated film made of polylactic acids which is not prone to delamination while having excellent piezoelectric properties and a manufacturing method thereof. That is, the present invention is obtained by the stretched laminated film manufactured by a co-extrusion process for use in piezoelectric polymer materials, containing a layer (A) which has poly-L-lactic acid as the primary component and contains an impact modifier in the range of 0.1 to 10 mass % and a layer (B) which has poly-D-lactic acid as the primary component and contains an impact modifier in the range of 0.1 to 10 mass %.

The present disclosure provides a manufacturing method of an ultrasonic fingerprint sensor. The method includes steps of: etching a plurality of through holes arranged in an array on an insulating substrate to form a frame; filling piezoelectric material into the through holes to form a plurality of piezoelectric posts corresponding to the plurality of through holes. The present disclosure also provides an ultrasonic fingerprint sensor. In the ultrasonic fingerprint sensor and the manufacturing method of the same according to the embodiment of the present disclosure, the frame is formed on the insulating substrate by etching, and the piezoelectric material is filled in the frame to form the piezoelectric posts to form the ultrasonic fingerprint sensor. The cost of the ultrasonic fingerprint sensor can be reduced because the etching apparatus is low-cost and the process is simple.