A coating method for producing a function layer on mechanically loaded components or surfaces includes providing or applying a first material layer of a first material or substrate matrix having a mechanical flexibility higher than that of a second material on a substrate constituting the component or the surface, respectively, structuring the first material layer such that the material layer surface of the first material layer, which is opposite to the substrate, obtains a three-dimensionally molded basic structure with projections and recesses, and coating the material layer surface of the first material layer with a second material layer of the second material in such a way that the second material layer adopts substantially the basic structure of the material layer surface with the projections and recesses. Also, surface layer structures can be produced by this method.

A method of fabricating a microelectronic device comprising providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A piezoelectric cantilever actuator system array prepared by a process comprising the steps of providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A microelectronic device comprising a base, a first anchor coupled to the base, and a first cantilever coupled to the first anchor, wherein the base, the first anchor, and the first cantilever are an integral structure formed from the same substrate material.

A technology of fabricating a piezoelectric composite applicable to an ultrasonic transducer is disclosed. According to one aspect of the present disclosure, a support member formed with a plurality of through holes is located on one surface of an electrode plate, and lower surfaces of piezoelectric pillars having shapes respectively corresponding to the through holes are adhered onto the one surface of the electrode plate to form the piezoelectric pillars. Further, according to an additional aspect, the plurality of piezoelectric pillars having shapes corresponding to the through holes of the support member are formed by sintering a piezoelectric pellet molded in a pillar shape.

A method for manufacturing an energy harvester including a piezoelectric polymer microstructure array. The method includes: preparing a micro-column array of a piezoelectric polymer on a substrate; supplying a plate electrode as an upper electrode, allowing the substrate and the upper electrode to form a pair of plate electrodes; applying a DC voltage between the pair of the plate electrodes; heating the substrate to a temperature higher than a glass transition temperature of the piezoelectric polymer and performing rheological formation of the micro-column array with the DC voltage still being applied until the column array of the piezoelectric polymer reaches the upper electrode to form a mushroom-shaped structure array; and cooling and solidifying the piezoelectric polymer to obtain the piezoelectric energy harvester.

A piezoelectric device manufactured using a substrate with a piezoelectric moldable layer. A stamp comprising a repeating pattern of unit cells formed by a grid of interconnected sidewalls separating respective apertures is used in a molding process comprising pushing the stamp into the moldable layer causing the piezoelectric material to be pushed into the respective apertures and form an array of pillars. In the stamp, the fraction of open area, formed by a respective aperture, is more than the fraction of solid area, formed by the surrounding sidewalls. In the resulting pillar structure the fraction of active area, formed by the pillars is more than the fraction of inactive area between the pillars. The stamp can be adapted to improve structural integrity while using relatively thin sidewalls.

A piezoelectric device manufactured using a substrate with a piezoelectric moldable layer. A stamp comprising a repeating pattern of unit cells formed by a grid of interconnected sidewalls separating respective apertures is used in a molding process comprising pushing the stamp into the moldable layer causing the piezoelectric material to be pushed into the respective apertures and form an array of pillars. In the stamp, the fraction of open area, formed by a respective aperture, is more than the fraction of solid area, formed by the surrounding sidewalls. In the resulting pillar structure the fraction of active area, formed by the pillars is more than the fraction of inactive area between the pillars. The stamp can be adapted to improve structural integrity while using relatively thin sidewalls.

A cylindrical structure including a first cloth including a piezoelectric thread that generates an electric potential from external energy, a second cloth including a piezoelectric thread that generates an electric potential from external energy, and a connection portion connecting the first cloth and the second cloth, wherein the first cloth and the second cloth forms a side face of the cylindrical structure.

This invention provides kilometer-long, endlessly parallel, spontaneously piezoelectric and thermally stable poly(vinylidene fluoride) (PVDF) ribbons using iterative size reduction technique based on thermal fiber drawing method. The PVDF ribbons are thermally stable and conserve the polar phase even after being exposed to heat treatment above the melting point of PVDF. A single PVDF ribbon has an average effective piezoelectric constant as 58.5 pm/V. PVDF ribbons in the invention are promising structures for constructing devices such as highly efficient energy generators, large area pressure sensors, artificial muscle and skin, due to the unique geometry and extended lengths, high polar phase content, high thermal stability and high piezoelectric coefficient.

The present invention provides a piezoelectric material not containing lead and potassium, showing satisfactory insulation and piezoelectricity, and having a high Curie temperature. The invention relates to a piezoelectric material includes a main component containing a perovskite-type metal oxide represented by Formula (1): (Na.sub.xBa.sub.1-y)(Nb.sub.yTi.sub.1-y)O.sub.3 (wherein, 0.80x0.94 and 0.83y0.94), and an additive component containing at least one element selected from Mn and Ni, wherein the content of the Ni is 0 mol or more and 0.05 mol or less based on 1 mol of the perovskite-type metal oxide, and the content of the Mn is 0 mol or more and 0.005 mol or less based on 1 mol of the perovskite-type metal oxide.

Disclosed are a preparation method for a graphene aerogel array sensor and use thereof. A miniature graphene aerogel array device is prepared by combining in-situ printing and solvent plasticization and foaming, which has excellent flexibility and stability, and is suitable for use in a variety of scenarios, such as sensors, and energy storage devices, etc. The array sensor provided in the present disclosure exhibites extremely high stability, high accuracy and reliability. Combining with deep machine learning, the array sensor can be endowed with the function of learning and recognition of machine intelligence, thus greatly promoting the development of the next generation of artificial intelligence.