method of fabricating a sensor including a polymer body and a strain gauge including at least one Schottky junction. The Schottky junction includes an active layer including a piezoelectric semiconductor material, preferably with a wurtzite crystalline structure. The Schottky junction further including at least one metal electrode electrically connected to the active layer. The method including the following steps: forming a polymer layer, growing the at least one metal electrode on the polymer layer, then growing the active layer by atomic layer deposition, ALD, on the polymer layer and on the metal electrode. A sensor includes a polymer body and a cantilever including a strain gauge obtained by ALD. A gauge factor of 150 is achieved at different frequencies.

method of fabricating a sensor including a polymer body and a strain gauge including at least one Schottky junction. The Schottky junction includes an active layer including a piezoelectric semiconductor material, preferably with a wurtzite crystalline structure. The Schottky junction further including at least one metal electrode electrically connected to the active layer. The method including the following steps: forming a polymer layer, growing the at least one metal electrode on the polymer layer, then growing the active layer by atomic layer deposition, ALD, on the polymer layer and on the metal electrode. A sensor includes a polymer body and a cantilever including a strain gauge obtained by ALD. A gauge factor of 150 is achieved at different frequencies.

A method of manufacturing an integrated circuit. This method includes forming an epitaxial material comprising single crystal piezo material overlying a surface region of a substrate to a desired thickness and forming a trench region to form an exposed portion of the surface region through a pattern provided in the epitaxial material. Also, the method includes forming a topside landing pad metal and a first electrode member overlying a portion of the epitaxial material and a second electrode member overlying the topside landing pad metal. Furthermore, the method can include processing the backside of the substrate to form a backside trench region exposing a backside of the epitaxial material and the landing pad metal and forming a backside resonator metal material overlying the backside of the epitaxial material to couple to the second electrode member overlying the topside landing pad metal.

A piezoelectric film layered structure includes a base, and a ScAlN film formed on the base. The ScAlN film has an unpaired electron density within a range between 1.7×10.sup.18 electrons/cm.sup.3, inclusive, and 1.1×10.sup.19 electrons/cm.sup.3, inclusive.

An apparatus for atomic scale processing includes: a reactor having inner and outer surfaces; where at least a portion of the inner surfaces define an internal volume of the reactor; a fixture assembly positioned within the internal volume of the reactor having a surface configured to hold a substrate within the internal volume of the reactor; a vacuum pump in communication with the reactor; at least one reactor pressure control device; and a controller in communication with the at least one reactor pressure control device, where the controller is configured to activate and deactivate the at least one reactor pressure control device to increase and decrease the pressure within the internal volume of the reactor, where the increase in the pressure within the internal volume of the reactor increases the temperature of the substrate from an initial temperature.

Provided is a piezoelectric element including a first electrode provided above a substrate, a piezoelectric layer including a plurality of crystal grains containing potassium, sodium, and niobium and provided above the first electrode, and a second electrode provided above the piezoelectric layer. An atom concentration N.sub.K1 (atm %) of potassium contained in grain boundaries of the crystal grains and an atom concentration N.sub.K2 (atm %) of potassium contained in the crystal grains satisfy a relationship of 1.0<N.sub.K1/N.sub.K2≤2.4.

A lead-free KNN-based piezoelectric material represented by the composition formula (K.sub.aNa.sub.bLi.sub.c)(Nb.sub.dTa.sub.eSb.sub.f)O.sub.g, where 0.4≤a≤0.5, 0.5≤b≤0.6, 0.01≤c≤0.1, 0.5≤d≤1.0, 0.05≤e≤0.15, 0.01≤f≤0.09, 1≤g≤3. In one embodiment, the lead-free KNN-based piezoelectric material has a d.sub.33>300 pm/V and a T.sub.curie>250° C. In one embodiment, the d.sub.33 and T.sub.curie of the lead-free textured KNN-based piezoelectric material can be adjusted by creating phase boundaries of (i) orthorhombic to tetragonal (O-T), (ii) rhombohedral to orthorhombic (R-O), and (iii) orthorhombic to tetragonal (O-T). In one embodiment, the lead-free KNN-based piezoelectric material is textured with NaNbO.sub.3 or Ba.sub.2NaNb.sub.5O.sub.15 seeds which are platelet or acicular shaped. In one embodiment, the amount, orientation, or particle size distribution of the NaNbO.sub.3 or Ba.sub.2NaNb.sub.5O.sub.15 texturing seeds in the lead-free textured KNN-based piezoelectric material can be altered.

The present invention makes clear and defines a congruent composition of a langasite-based oxide, and establishes a method of manufacturing a crystal by any desired composition of AE.sub.3ME.sub.1+a(Ga.sub.1−xAl.sub.x).sub.3+bSi.sub.2+cO.sub.14 (AE is an alkaline-earth metal, ME is Nb or Ta, 0≤x≤1, −0.5<a≤0 or 0<a<0.5, −0.5<b≤0 or 0<b≤0.5, and −0.5<c≤0 or 0<c<0.5, excluding a=b=c=0). This makes it possible to suppress the formation of an impurity, and improve the yield and crystal manufacturing rate. The raw material is a raw material mixture prepared by mixing an alkaline-earth metal or its carbonate or oxide, Nb or Ta or its oxide, Ga or its oxide, Al or its oxide, and Si or its oxide.

A method of manufacturing a monocrystalline layer comprises the following successive steps: providing a donor substrate comprising a piezoelectric material of composition ABO.sub.3, where A consists of at least one element from among Li, Na, K, H, Ca; and B consists of at least one element from among Nb, Ta, Sb, V; providing a receiver substrate, transferring a layer called the “seed layer” from the donor substrate on to the receiver substrate, such that the seed layer is at the bonding interface, followed by thinning of the donor substrate layer; and growing a monocrystalline layer of composition A′B′O.sub.3 on piezoelectric material ABO.sub.3 of the seed layer, where A′ consists of a least one of the following elements Li, Na, K, H; B′ consists of a least one of the following elements Nb, Ta, Sb, V; and A′ is different from A or B′ is different from B.

A method of manufacturing a monocrystalline layer, comprises the following successive steps: providing a donor substrate comprising a piezoelectric material of composition ABO.sub.3, where A consists of at least one element from among Li, Na, K, H, Ca; and B consists of at least one element from among Nb, Ta, Sb, V; providing a receiver substrate, transferring a layer called the “seed layer” from the donor substrate on to the receiver substrate, such that the seed layer is at the bonding interface, followed by thinning of the donor substrate layer; and growing a monocrystalline layer of composition A′B′O.sub.3 on piezoelectric material ABO.sub.3 of the seed layer where A′ consists of a least one of the following elements Li, Na, K, H; B′ consists of a least one of the following elements Nb, Ta, Sb, V; and A′ is different from A or B′ is different from B.