Described herein are aspects of a three-dimensional (3D) piezoelectric structure that can be composed of a 3D periodic microlattice that can be composed of a piezoelectric composite material, wherein the 3D periodic microlattice can include a plurality of interconnected 3D node units capable of generating a piezoelectric response upon application of a stress to the 3D periodic microlattice, and wherein the plurality of interconnected 3D node units can form a tailored piezoelectric tensor space. Also described herein are systems that can include one or more of the 3D piezoelectric structures described herein. Also described herein are methods of making and using the 3D piezoelectric structures described herein.

A method for fabricating nano-electro-mechanical tags for identification and authentication includes, in part, forming a protective layer above a substrate, forming a first conductive layer above the protective layer serving as a first electrode, forming a piezoelectric layer above the first conductive layer, forming a second conductive layer above the piezoelectric layer, patterning the second conductive layer to form a second electrode, patterning the piezoelectric layer to expose one or more portions of the first conductive layer, and forming one or more trenches that extends into a plurality layers formed above. In addition, a sacrificial layer can be formed above portions of the substrate, and the sacrificial layer can be removed by etching to release the nano-electro-mechanical tags from the substrate.

Disclosed herein are perovskite materials and methods of making an use thereof.

The present invention relates to a piezoelectric structure, a method of fabricating the same, and a pressure sensor using the same. A piezoelectric structure comprises perovskite structure layers including a material having an ABO.sub.3 perovskite structure and an interlayer including a metal oxide A*O interposed between the perovskite structure layers. A or A* is one of an alkaline earth metal element, an alkali metal element, a lanthanum group element, and a post-transition metal element, B is a transition metal element, and O is an oxygen element.

A method of forming a film can include heating a CVD reactor chamber containing a substrate to a temperature range between about 750 degrees Centigrade and about 950 degrees Centigrade, providing a first precursor comprising Al to the CVD reactor chamber in the temperature range, providing a second precursor comprising Sc to the CVD reactor chamber in the temperature range, providing a third precursor comprising nitrogen to the CVD reactor chamber in the temperature range, and forming the film comprising ScAlN on the substrate.

The invention relates to an optoelectronic device (1) comprising: at least one diode (2) that has a semiconductor portion (20) in which a PN or PIN junction is formed; a peripheral conductive layer (40) that extends in the main plane in such a way as to surround the semiconductor portion (20); a peripheral piezoelectric portion (30) that extends in the main plane in such a way as to surround the semiconductor portion (20); a first polarizing electric circuit (30) capable of generating an electric field in the peripheral piezoelectric portion (30) by applying an electric potential at least to the peripheral conductive layer (40) so as to induce a deformation of the peripheral piezoelectric portion (30) in the direction of the main plane, thus causing a tensile deformation of the semiconductor portion (20) in the main plane.

A subtractive forming method that includes providing a material stack including a samarium and selenium containing layer and an aluminum containing layer in direct contact with the samarium and selenium containing layer. The samarium component of the samarium and selenium containing layer of the exposed portion of the material stack is etched with an etch chemistry comprising citric acid and hydrogen peroxide that is selective to the aluminum containing layer. The hydrogen peroxide reacts with the aluminum containing layer to provide an oxide etch protectant surface on the aluminum containing layer, and the citric acid etches samarium selectively to the oxide etch protectant surface. Thereafter, a remaining selenium component of is removed by elevating a temperature of the selenium component.

A transceiver device for receiving an interrogation signal at a first carrier frequency and for transmitting a response signal at a second carrier frequency is disclosed. The interrogation signal comprises the first carrier frequency modulated at the second carrier frequency. The communication device includes a sensor coupled to a demodulator. The sensor receives a low frequency input used to further modulate the interrogation signal. The demodulator demodulates the low frequency input from the first carrier frequency to thereby generate the response signal comprising the second carrier frequency and the low frequency input. The demodulator preferably includes a pyroelectric demodulator, a piezoelectric demodulator, or a detector diode. The demodulator preferably has a frequency response less than the first carrier frequency but greater than the second carrier frequency.

A method of forming a monolithic integrated PMUT and CMOS with a coplanar elastic, sealing, and passivation layer in a single step without bonding and the resulting device are provided. Embodiments include providing a CMOS wafer with a metal layer; forming a dielectric over the CMOS; forming a sacrificial structure in a portion of the dielectric; forming a bottom electrode; forming a piezoelectric layer over the CMOS; forming a top electrode over portions of the bottom electrode and piezoelectric layer; forming a via through the top electrode down to the bottom electrode and a second via down to the metal layer through the top electrode; forming a second metal layer over and along sidewalls of the first and second via; removing the sacrificial structure, an open cavity formed; and forming a dielectric layer over a portion of the CMOS, the open cavity sealed and an elastic layer and passivation formed.

A bonding layer 3 is formed over a piezoelectric material substrate, and the bonding layer is made of one or more materials selected from the group consisting of silicon nitride, aluminum nitride, alumina, tantalum pentoxide, mullite, niobium pentoxide and titanium oxide. A neutralized beam is irradiated onto a surface of the bonding layer and a surface of a supporting body to activate the surface of the bonding layer and the surface of the supporting body. The surface of the bonding layer and the surface of the supporting body are bonded by direct bonding.