A metal substrate supported by a wiring substrate includes a first extending portion and a first connection portion connected to the first extending portion. The first connection portion includes a first region facing a portion of a wiring substrate in a Z-axis direction, a second region being continuous from the first region, and a third region being continuous from the second region. When viewed in the Z-axis direction, in a direction perpendicular to a connection direction in which the third region is connected to the second region, a width of the second region is larger than a width of the third region. A first bonding member bonding the wiring substrate and the metal substrate includes a first portion disposed between the portion and the first region, and a second portion being continuous from the first portion. The second portion reaches the second region but does not reach the third region.

A metal substrate supported by a wiring substrate includes a movable portion, a first extending portion, a first coupling portion that couples the first extending portion and the movable portion, and a first connection portion connected to the first extending portion. The first connection portion includes a first fixing region fixed to the wiring substrate, and a first connection region connected to the first extending portion and to the first fixing region. The first connection region includes a first bent portion. The first bent portion has a first outer edge on a movable portion side, and a second outer edge opposite the movable portion, and each of the first outer edge and the second outer edge is bent toward the movable portion side when viewed in a Z-axis direction.

A transducer is disclosed which includes lead zirconate titanate (PZT) particles mixed with graphene nanoplatelets (GNPs) in a flexible substrate aligned in a first direction, forming a transducer subsystem, a first conductive protective electrode having a width and a length providing an electrical connectivity to an external circuit, a second conductive protective electrode having the width and the length providing an electrical connectivity to the external circuit, wherein the transducer subsystem is sandwiched between the first and second conductive protective electrodes.

A method for fabricating an intravascular imaging assembly is provided. In one embodiment, the method includes forming a stacked structure (415) having a plurality of sacrificial material layers disposed between a plurality of ultrasound material layers in an alternating pattern; dicing the stacked structure (420) to form a plurality of elongated strips, each comprising an array of ultrasound elements defined by the plurality of ultrasound material layers and spacers defined by the plurality of sacrificial material layers; coupling a first elongated strip (430) of the plurality of elongated strips to a flexible circuit substrate; and removing the spacers (435) of the first elongated strip from the flexible circuit substrate.

A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.

A piezoelectric actuator includes a vibrating section including a piezoelectric element, a distal end face, and a recess opened on the distal end face and a protrusion section including a base that overlaps the recess in plan view of the distal end face and is fixed to the distal end face and a projection that is provided in the base and projects in an opposite direction of the distal end face, the protrusion section transmitting a driving force of the vibrating section to a driven section. In plan view of the distal end face, the projection is disposed within a range of the recess.

A resonator element includes: a substrate; and an electrode that includes a first conductive layer provided on a surface of the substrate, and a second conductive layer, provided on the opposite side to the first conductive layer on the substrate side, which is disposed within an outer edge of the first conductive layer when seen in a plan view from a direction perpendicular to the surface.

A medical, particularly a dental or dental surgical, ultrasonic treatment device for generating ultrasonic vibrations and transmitting the ultrasonic vibration to a tool, which can be connected to the ultrasonic treatment device, the medical ultrasonic treatment device having: an ultrasonic vibration generator with a plurality of piezoelectric elements to which an electric voltage can be applied, and a circuit board to supply the plurality of piezoelectric elements with the electric voltage. Furthermore, a method for manufacturing a corresponding medical ultrasonic treatment device is described.

An object of the present invention is to provide a piezoelectric element capable of improving the sound pressure particularly in a high frequency band by decreasing the impedance in a case of being used as an electroacoustic transducer or the like, and a piezoelectric speaker formed of a piezoelectric film. The object can be achieved by using a piezoelectric film in which a piezoelectric layer containing piezoelectric particles in a polymer matrix is sandwiched between electrode layers, a planar shape is a polygon, the piezoelectric film has a protruding portion protruding from a side of a polygon other that a shortest side, and the protruding portion is provided with connecting portions for connecting an external power supply and an electrode layer or identical connecting portions are provided in the vicinity of end portions on a side other than the shortest side.

Provided is a vibration panel including an inner member, a first outer member, a second outer member, a piezoelectric actuator, an actuator bonding layer, and a filler. The inner member includes first and second main surfaces. The first outer member includes third and fourth main surfaces, the third main surface including a first region and a second region. The second outer member includes fifth and sixth main surfaces, the fifth main surface including a third region and a fourth region. The piezoelectric actuator causes vibration. The actuator bonding layer is disposed between the piezoelectric actuator and the second region and bonds the piezoelectric actuator to the second region. The filler fills a space between the second region and the fourth region and covers the piezoelectric actuator.