A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 μm or less.

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.

An apparatus includes a dielectric tile array including a plurality of dielectric tiles; and a plurality of electroactive (EA) material blocks configured to expand or contract in response to being actuated by the application of an actuation voltage.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include a dielectric protection layer (DPL) that protects the piezoelectric layer from etching processes that can produce rough surfaces and reduces parasitic capacitance around the perimeter of the resonator when the DPL's dielectric constant is lower than that of the piezoelectric layer. The DPL can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, or both.

A piezoelectric device includes a diaphragm, a piezoelectric actuator, and an orientation layer between the diaphragm and the piezoelectric layer. The piezoelectric actuator has a first electrode, a piezoelectric layer, and a second electrode, with the first electrode, a piezoelectric layer, and a second electrode on the diaphragm. The orientation layer is a stack of two or more tiers.

An ultrasound probe of the present disclosure includes an ultrasound element unit 1, to which a flexible substrate 7 is connected, the flexible substrate 7 including lamination of a ground layer 7e and a signal layer 7a via an insulation layer 7c. The flexible substrate 7 includes a bending part and a flat part. The signal layer 7a includes a linear first signal line and a linear second signal line that are adjacent to each other. The ground layer 7e at the bending part includes a linear first ground line and a linear second ground line that are adjacent to each other. The first signal line and the first ground line are opposed to each other, and the second signal line and the second ground line are opposed to each other.

A piezoelectric vibrator according to the invention has a base, an integrated circuit element, and a piezoelectric vibration element. The base has internal terminal pads, and external terminals including an AC output terminal. The base includes rectangular ceramic substrate layers stacked in at least three layers, each of which has castellations formed at four corners. Among the internal terminal pads, internal terminal pads for the integrated circuit element and internal terminal pads for the piezoelectric vibration element are connected to each other by externally exposed wiring patterns formed on upper surfaces of the castellations at the corners of the ceramic substrate constituting a middle layer.

A multilayer ceramic electronic component is provided in which wet spreading of a metal bump material can be suppressed and a position of the metal bump can be controlled with high accuracy. The multilayer ceramic electronic component includes a ceramic body having first and second main surfaces and first to fourth lateral surfaces between the main surfaces. Moreover, first and second opposing internal electrodes are provided inside the ceramic body and led out to one or more of the second lateral surfaces. A first electrode is provided on the first main surface and contains a ceramic material and a first external electrode that is connected to the first internal electrode, extends on the first electrode. In addition, a second external electrode is connected to the second internal electrode and extends onto the first main surface.

A backing member includes: a resin layer which contains a filler; and a plurality of leads each of which is embedded in the resin layer to penetrate through the resin layer from an upper surface of the resin layer to a lower surface of the resin layer. Each of the leads includes a wiring portion, and a terminal portion connected to one end of the wiring portion. A width dimension and a depth dimension of the wiring portion are smaller than a width dimension and a depth dimension of the terminal portion, and an interval between adjacent ones of the wiring portions of the leads is wider than an average particle size of the filler.

A thin gas transportation device includes an inlet plate, a resonance sheet, an actuating element, a first insulation frame attached to the actuating element, a conductive frame, and a second insulation frame attached to the conductive frame. The conductive frame has a conductive outer frame attached to the first insulation frame, an elastic conductive pin, and a conductive piece connected to an outer edge portion of the conductive outer frame. One end of the elastic conductive pin is connected to an inner edge portion of the conductive outer frame, and the other end of the elastic conductive pin extends obliquely toward the actuating element and forms a bent portion. The bent portion presses against the actuating element and is electrically connected to the actuating element, and the bent portion is strip-shaped.