A sensor has a sensor element (5) with two opposite sides (11, 9) and an interconnect (7) with first and second terminal segments (13B, 13F) interconnected by an intermediate segment (42). The first terminal segment (13F) is positioned against a first side (11) of the sensor element and comprises a first contact terminal (50). The second terminal segment (13B) is positioned against the second side (9) of the two opposite sides of the sensor element and comprises a second contact terminal (52) on a surface facing the second side (11). There are third and fourth, external, contact terminals (54, 56). The interconnect provided electrical connections between the first and fourth contact terminals (50, 56) and between the second and third contact terminals (52, 54).

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. One or more patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the one or more electrodes and a planarized support layer is deposited over the sacrificial layer. The support layer is etched to form one or more cavities overlying the electrodes to expose the sacrificial layer. The sacrificial layer is etched to release the cavities around the electrodes. Then, a cap layer is fusion bonded to the support layer to enclose the electrodes in the support layer cavities.

A piezoelectric actuator is provided, including a vibration plate, a piezoelectric layer, a plurality of individual electrodes arranged in two arrays, first and second common electrodes which have first and second facing portions facing parts of the individual electrodes and first and second connecting portions connecting the first and second facing portions respectively, and first and second wiring portions which are arranged on the vibration plate and which are connected to the first and second common electrodes respectively via first and second connecting wirings, wherein one of the first connecting wirings connects the first connecting portion and one of the first wiring portion while striding over the second connecting portion.

A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

Disclosed herein is a piezoelectric vibration module capable of improving adhesion between a piezoelectric element and an external electrode disposed on the piezoelectric element, the piezoelectric vibration module, including: a piezoelectric element printing patterns of a first internal electrode and a second internal electrode therein and having a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode on an external surface thereof, wherein the first external electrode and the second external electrode are made of silver (Ag) and are formed on the external surface of the piezoelectric element.

A piezoelectric actuator includes: a plurality of discrete electrodes, which is disposed on one side of a piezoelectric element; a common electrode, which is disposed on the other side of the piezoelectric element; a plurality of discrete contacts, which are respectively connected to the plurality of discrete electrodes, and wherein the plurality of discrete electrodes include: a first discrete electrode; and a second discrete electrode, which is disposed at a position away from a corresponding discrete contact as compared with the first discrete electrode, wherein the common electrode includes: a first common electrode, which faces the first discrete electrode in the thickness direction; and a second common electrode, which is separated from the first common electrode in the surface direction and faces the second discrete electrode in the thickness direction, and wherein a connection wiring is provided to connect the first common electrode with the second common electrode.

An electronic device includes a switching element, a first common-electrode wiring, at least a part of the first common-electrode wiring being covered with the switching element, a plurality of second common-electrode wirings branched from the part of the first common-electrode wiring covered with the switching element, a plurality of individual power-output terminals arranged in a row in the switching element, and a plurality of individual-electrode wirings arranged in a row, the plurality of individual-electrode wirings being connected to the plurality of individual power-output terminals, respectively. Each of the plurality of second common-electrode wirings is disposed between the plurality of individual-electrode wirings.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. A first patterned electrode is deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the first electrode and a planarized support layer is deposited over the sacrificial layer, which is then bonded to a substrate wafer. The crystalline substrate is removed and a second patterned electrode is deposited over a second surface of the film. The sacrificial layer is etched to release the air reflection cavity. Also, a cavity can instead be etched into the support layer prior to bonding with the substrate wafer. Alternatively, a reflector structure can be deposited on the first electrode, replacing the cavity.

A method for manufacturing a package structure carries out in following way. A flexible circuit board is provided. The flexible circuit board defines a bent area and a laminated area. The flexible circuit board includes a first dielectric layer, a first conductive pattern and a bearing layer located at opposite sides. The bearing layer corresponds to the laminated area. A second dielectric layer and a second conductive pattern are formed on the first conductive pattern. A third dielectric layer and a third conductive pattern are formed on the bearing layer. All of the second and third dielectric layers, and the second and third conductive pattern corresponds to the laminated area. A first solder resist layer is formed on the second conductive layer. The first solder resist layer defines a plurality of openings, a portion of the second conductive pattern is exposed from the openings defining a plurality of first pads.