A resonator device includes a base substrate that is formed of a single crystal semiconductor and includes a first surface, a resonator element attached to the first surface of the base substrate, and a cover that is bonded to the first surface of the base substrate, accommodates the resonator element between the cover and the base substrate, and is formed of a single crystal semiconductor. The base substrate and the cover are bonded through an amorphous layer.

An ultrasonic transducer of this invention includes a rigid substrate with opening parts extending between bottom and top surfaces, a flexible resin film fixed to the top surface of the substrate to cover the opening parts, and piezoelectric elements fixed to a top surface of the resin film so as to overlap in a plan view with the opening parts, respectively. An arrangement pitch of the piezoelectric elements is preferably set to be equal to or less than 4.3 mm, and the piezoelectric element may have a rectangular shape in the plan view having longitudinal and lateral dimensions in the plan view with a maximum value of 4.0 mm or less, a circular shape in the plan view having a diameter of 4.0 mm or less, or an elliptical shape in the plan view having a major axis of 4.0 mm or less.

Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip in which a pad barrier layer caps a pad of a piezoelectric device. The pad barrier layer is configured to block hydrogen ions and/or other errant materials from diffusing to the piezoelectric layer. Absent the pad barrier layer, hydrogen ions from hydrogen-ion containing processes performed after forming the pad may diffuse to the piezoelectric layer along a via extending from the pad to the piezoelectric device. By blocking diffusion of hydrogen ions and/or other errant materials to the piezoelectric device, the pad barrier layer may prevent delamination and breakdown of the piezoelectric layer. Hence, the pad barrier layer may prevent failure of the piezoelectric device.

An ultrasonic sensor includes a casing and a piezoelectric vibrator element. The casing includes a first unit made of a metal and a second unit made of a resin. The first unit has a cylindrical or substantially cylindrical shape extending in a first direction. The second unit is connected to one end of the first unit in the first direction and includes a cylindrical section and a bottom plate. The cylindrical section extends in the first direction. The bottom plate is a disk-shaped portion which closes an end of the cylindrical section positioned farther away from the first unit in the first direction. The piezoelectric vibrator element is mounted on the bottom plate.

A transduction unit of a non-contact human sleep physiological parameter detection sensor includes a circuit board, a piezoelectric film and conductive adhesives, wherein the piezoelectric film includes a film sheet and two electrodes, which are respectively arranged on two side faces of the film sheet; the piezoelectric film is attached to the circuit board; and the two electrodes of the piezoelectric film are respectively electrically connected to two exposed pad electrodes on the circuit board by means of the conductive adhesives.

Provided is a polymer-based piezoelectric composite material film which has high conversion efficiency and is capable of reproducing a sound with a sufficient volume. The polymer-based piezoelectric composite material film is a film including a polymer-based piezoelectric composite material which contains piezoelectric particles in a matrix containing a polymer material, and two electrode layers which are laminated on both surfaces of the polymer-based piezoelectric composite material, in which a coefficient of variation of intensity ratio α.sub.1 of (002) plane peak intensity and (200) plane peak intensity derived from the piezoelectric particles=(002) plane peak intensity/((002) plane peak intensity+(200) plane peak intensity) in a case where the polymer-based piezoelectric composite material is evaluated by an X-ray diffraction method is less than 0.3.

A vibration module is disclosed. The vibration module includes a film, a piezoelectricity device, and a substrate. The film has a first surface. The piezoelectricity device is disposed on the first surface. The substrate is disposed on the first surface by in-mold injection method, which contacts and surrounds the piezoelectricity device.

A piezoelectric device including a substrate, a metal-insulator-metal element, a hydrogen blocking layer, a passivation layer, a first contact terminal and a second contact terminal is provided. The metal-insulator-metal element is disposed on the substrate. The hydrogen blocking layer is disposed on the metal-insulator-metal element. The passivation layer covers the hydrogen blocking layer and the metal-insulator-metal element. The first contact terminal is electrically connected to the metal-insulator-metal element. The second contact terminal is electrically connected to the metal-insulator-metal element.

The present application relates to an energy conversion apparatus. The energy conversion apparatus comprises: an upper conductive layer; a lower conductive layer, which is arranged below the upper conductive layer; and at least one piezoelectric micro/nano unit and a fluid, which are arranged between the upper conductive layer and the lower conductive layer, wherein the piezoelectric micro/nano unit has a piezoelectric property and is immersed in the fluid. The present application further relates to a preparation method for an energy conversion apparatus and the use thereof.

An object of the present invention is to provide a piezoelectric element formed of a piezoelectric film including an electrode layer provided on each of both surfaces of a piezoelectric layer and a protective layer provided on the surface of the electrode layer, in which the electrode layer and a conductive member such as a lead wire can be connected to each other with high productivity and the resistance of the connection is also low. The object thereof is achieved by opening through-holes in the protective layer of the piezoelectric film and the conductive member, allowing both through-holes to at least partially overlap each other, filling the through-hole of the protective layer with a conductive filling member, and allowing the filling member to reach the through-hole of the conductive member.