This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

A variable-structure stacked cable topology includes: a plurality of sections of stacked cables. The plurality of sections of the stacked cables are connected sequentially. The sections of the stacked cables includes a plurality of base tapes at an equal quantity. The plurality of base tapes are connected mutually. At least one of the plurality of base tapes is a superconducting tape. A cable topological structure is formed by sequentially connecting a plurality of sections of stacked cables. Each of the sections of the stacked cables is provided with superconducting tapes or a combination of superconducting tapes and copper tapes to form a variable-structure cable topological structure. By packaging a different number of superconducting tapes in each area, this section of cable can be twisted into a coil in such a way that a critical current of the whole coil can be approximately uniform along a length direction of the cable.

An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 μm.

Various fabrication methods are disclosed. In one such method, at least one structure is formed on a substrate which protrudes outwardly from a plane of the substrate. A beam is used to form a layer of material, at least part of which is in direct contact with a semiconductor structure on the substrate, the semiconductor structure comprising at least one nanowire. The beam has a non-zero angle of incidence relative to the normal of the plane of the substrate such that the beam is incident on one side of the protruding structure, thereby preventing a portion of the nanowire in a shadow region adjacent the other side of the protruding structure in the plane of the substrate from being covered with the material.

A high-temperature superconducting filament and cable, and a method for manufacturing same. The substrate used to grow the superconducting layer is removed, and the exfoliated superconducting layer is coated with a protective layer, and then sliced into narrow strips. The strips are thereafter encapsulated with a conductive metal to provide a high-temperature superconducting filament. The filaments may be bundled together to provide a high-temperature superconducting cable.

Various fabrication method are disclosed. In one such method, at least one structure is formed on a substrate which protrudes outwardly from a plane of the substrate. A beam is used to form a layer of material, at least part of which is in direct contact with a semiconductor structure on the substrate, the semiconductor structure comprising at least one nanowire. The beam has a non-zero angle of incidence relative to the normal of the plane of the substrate such that the beam is incident on one side of the protruding structure, thereby preventing a portion of the nanowire in a shadow region adjacent the other side of the protruding structure in the plane of the substrate from being covered with the material.

According to an embodiment, a superconducting wire includes a substrate, an intermediate layer formed on the substrate, a superconducting layer formed on the intermediate layer, and a protective layer formed on the superconducting layer. The superconducting layer has a first portion, a second portion, and a third portion between the first portion and the second portion in the longitudinal direction of the superconducting wire. The protective layer on the third portion is at least partially removed.

A superconducting nanowire single photon detector (SNSPD) device includes a substrate, a distributed Bragg reflector on the substrate, a seed layer of a metal nitride on the distributed Bragg reflector, and a superconductive wire on the seed layer. The distributed Bragg reflector includes a plurality of bi-layers, each bi-layer including lower layer of a first material and an upper layer of a second material having a higher index of refraction than the first material. The wire is a metal nitride different from the metal nitride of the seed material.

A 2nd generation high temperature superconductor wire that prevents mechanical destruction from the wire edge due to slitting. A 2G HTS wire according to embodiments of the present invention has a structure that prevents mechanical destruction from the wire edge. This can be accomplished by forming a striation at or near the edge of the wire where the buffer and superconducting layers are removed to prevent any propagation of edge cracks from damaging the HTS wire.

A bundle of superconducting cables employs a plurality of superconducting cables, each having a former and a plurality of superconducting tape conductors wound in at least one layer around the former in a helical fashion. Each superconducting tape conductor has at least one superconducting layer. Each superconducting cable lacks an outer insulating layer and is held in a bundle of cables with each other superconducting cable of the plurality of superconducting cables. A sheath of non-conductive material covers the bundle of cables.