The substrate and buffer layers, of either one-sided or two-sided superconducting tape, are separated from the YCBO layer(s) of the tape by a combined action of radiative or inductive heat and mechanical force via a reel-to-reel manufacturing process. The exfoliation process may also utilize an air blade(s) to facilitate the separation of the layers of the tape.

A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination, placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system, adjusting the working distance, laser-cutting an outline, peeling off the solder ribbon, allowing the desired solder shape to remain, creating indexing holes, providing a target surface on an alignment fixture with indexing pins, aligning the indexing holes, placing the semiconductor release tape with the desired solder shape on the target surface, pressing the desired solder shape onto the target surface, removing the release tape, and making a pattern of the desired solder shape with precise alignment and decal bonding on the target surface.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

A high-temperature superconducting filament and cable, and a method for manufacturing same. The substrate used to grow the superconducting layer is removed, and the exfoliated superconducting layer is coated with a protective layer, and then sliced into narrow strips. The strips are thereafter encapsulated with a conductive metal to provide a high-temperature superconducting filament. The filaments may be bundled together to provide a high-temperature superconducting cable.

An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 ?m.

A method for producing an oxide superconducting thin film wire having a particular width includes a cutting step of cutting a wide oxide superconducting thin film wire in a longitudinal direction with the particular width, the wide oxide superconducting thin film wire being obtained by forming an oxide superconducting layer above a belt-shaped metal substrate with an intermediate layer disposed therebetween. In the cutting step, the wide oxide superconducting thin film wire is thermally cut in the longitudinal direction with the particular width by irradiating, with infrared laser light, a portion of the wide oxide superconducting thin film wire to be cut.

A superconducting wire includes a substrate and a superconducting material layer. The substrate includes a first main surface and a second main surface opposite to the first main surface. The superconducting material layer is disposed on the first main surface. Along at least a part of the superconducting wire in a direction in which the superconducting wire extends, the superconducting material layer is disposed to cover a side surface of the substrate in a width direction of the substrate and cover at least a part of the second main surface. A thickness of the superconducting material layer located on the first main surface varies along the width direction. A maximum thickness of the superconducting material layer located on the second main surface is smaller than a maximum thickness of the superconducting material layer located on the first main surface.

A superconductor wire having a first HTS layer with a first cap layer in direct contact with a first surface of the first HTS layer and a second cap layer in direct contact with a second surface of the first HTS layer. There is a first lamination layer affixed to the first cap layer and a stabilizer layer having a first surface affixed to the second cap layer. There is a second HTS layer and a third cap layer in direct contact with a first surface of the second HTS layer and a fourth cap layer in direct contact with a second surface of the second HTS layer. There is a second lamination layer affixed to the fourth cap layer. The second surface of the stabilizer layer is affixed to the third cap layer and there are first and second fillets disposed along a edge of the laminated superconductor.

An oxide superconducting wire includes: a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer; a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate; a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 m to 10 m; and a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween, wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 m per film formation.

A superconducting wire having improved electrical and physical properties.