Provided is a resistive memory structure and a manufacturing method thereof. The resistive memory structure includes a substrate, a dielectric layer, a resistive memory device, a hard mask layer, and a spacer. The dielectric layer is located on the substrate. The dielectric layer has an opening. The resistive memory device is located in the opening and has a protrusion outside the opening. The resistive memory device includes a first electrode, a variable resistance layer, and a second electrode. The variable resistance layer is located on the first electrode. The second electrode is located on the variable resistance layer. The hard mask layer covers a top surface of the variable resistance layer. The spacer covers a sidewall of the variable resistance layer in the protrusion.

The present invention provides a preparation method of a bipolar gating memristor and a bipolar gating memristor. The preparation method includes: preparing a lower electrode; depositing a resistive material layer on the lower electrode; and depositing an upper electrode on the resistive material layer by using a magnetron sputtering manner to deposit the upper electrode, controlling upper electrode metal particles to have suitable kinetic energy by controlling sputtering power, controlling a vacuum degree of a region where the upper electrode and the resistive material layer are located, such that a redox reaction occurs spontaneously between the upper electrode and the resistive material layer during the deposition of the upper electrode to form a built-in bipolar gating layer; and continuously depositing the upper electrode on the built-in bipolar gating layer.

A method of forming an electronic device comprises forming a stack structure comprising vertically alternating insulative structures and additional insulative structures, and forming pillars comprising a channel material and at least one dielectric material vertically extending through the stack structure. The method comprises removing the additional insulative structures to form cell openings, forming a first conductive material within a portion of the cell openings, and forming a fill material adjacent to the first conductive material and within the cell openings. The fill material comprises sacrificial portions. The method comprises removing the sacrificial portions of the fill material, and forming a second conductive material within the cell openings in locations previously occupied by the sacrificial portions of the fill material. Related electronic devices, memory devices, and systems are also described.

Methods of forming variable-resistance devices include forming a variable-resistance layer between a first terminal and a second terminal from a material that varies in resistance based on an oxygen concentration. An electrolyte layer is formed over the variable-resistance layer from a material that is stable at room temperature and that conducts oxygen ions in accordance with an applied voltage. A conductive gate layer is formed over the electrolyte layer.

Various embodiments of the present disclosure are directed towards a memory cell including a co-doped data storage structure. A bottom electrode overlies a substrate and a top electrode overlies the bottom electrode. The data storage structure is disposed between the top and bottom electrodes. The data storage structure comprises a dielectric material doped with a first dopant and a second dopant.

A phase-change material based resistive memory contains a resistive layer and two electrical contacts. After fabrication the memory is subjected to thermal treatment which initiates a transition toward a crystalline state favoring in this way the subsequent obtaining of a large number of resistive memory states.

Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method includes forming a bottom electrode over a substrate. A data storage structure is formed on the bottom electrode. The data storage structure comprises a first dopant with a first atomic percent and a second dopant with a second atomic percent. The first atomic percent is different from the second atomic percent. A top electrode is formed on the data storage structure.

Disclosed are an artificial sensory nervous circuit and a manufacturing method thereof. The artificial sensory nervous circuit includes a sensor (S), a first memristor (RS), and a neuron circuit, where the first memristor (RS) has a unidirectional resistance characteristic. The sensor (S) is configured to sensing an external signal and generating an excitation signal according to the external signal. The first memristor (RS) is configured to generating a response signal according to the excitation signal. The neuron circuit is configured to perform charging and discharging according to the response signal so as to output a pulse signal. With the artificial sensory nervous circuit and the manufacturing method thereof, sensitivity and habituation characteristics of biological perception are realized by using a simple circuit.

A phase-change material based resistive memory contains a resistive layer and two electrical contacts. After fabrication the memory is subjected to thermal treatment which initiates a transition toward a crystalline state favoring in this way the subsequent obtaining of a large number of resistive memory states.

Various embodiments of the present disclosure are directed towards a memory device including a data storage structure overlying a substrate. A bottom electrode overlies the substrate and a top electrode overlies the bottom electrode. The data storage structure is disposed between the bottom electrode and the top electrode. The data storage structure comprises a dielectric material doped with a first dopant and a second dopant, where the first dopant is different from the second dopant.