A memory structure is provided. The memory structure includes a top terminal, a multi-level nonvolatile electrochemical cell, a bottom terminal, a pedestal contact in the same metal level as the bottom terminal, and a vertical conductor fully self-aligned to the multi-level nonvolatile electrochemical cell and extending vertically from the pedestal contact.

An approach to forming a semiconductor structure is provided. The semiconductor structure includes two adjacent fins on a substrate. A gate stack is on each of the two adjacent fins. The semiconductor structure includes a first source/drain on a first end of each fin of the two adjacent fins and a second source/drain on a second end of each fin of the two adjacent fins. The semiconductor structure includes a switching layer on at least the first source/drain on the first end of each fin of the two adjacent fins and a top electrode on the switching layer. A metal material over the top electrode in the semiconductor structure.

A semiconductor device includes a memory structure over a substrate, wherein the memory structure includes a first word line; a first bit line over the first word line; a second bit line over the first bit line; a memory material over sidewalls of the first bit line and the second bit line; a first control word line along a first side of the memory material, wherein the first control word line is electrically connected to the first word line; a second control word line along a second side of the memory material that is opposite the first side; and a second word line over the second bit line, the first control word line, and the second control word line, wherein the second word line is electrically connected to the second control word line.

A resistive memory device includes a bottom electrode, a switching layer including a first horizontal portion, a second horizontal portion over an upper surface of the bottom electrode, and a first vertical portion over a side surface of the bottom electrode, a top electrode including a first horizontal portion over the first horizontal portion of the switching layer, a second horizontal portion over the second horizontal portion of the switching layer, and a first vertical portion over the first vertical portion of the switching layer, and a conductive via contacting the first horizontal portion, the second horizontal portion and the first vertical portion of the top electrode. By providing a switching layer and a top electrode which conform to a non-planar profile of the bottom electrode, charge crowding and a localized increase in electric field may facilitate resistance-state switching and provide a reduced operating voltage.

The present application discloses a ReRAM device, the bottom surface of a first resistance switching layer is connected with a bottom electrode, and a first groove is formed in the center of the top surface of the first resistance switching layer. A second resistance switching layer is formed on the first resistance switching layer, the center of the bottom surface of the second resistance switching layer is filled downwards into the first groove, and the top surface of the second resistance switching layer is connected with a top electrode. The material of the second resistance switching layer is more conductive than the material of the first resistance switching layer. The present application can maintain the stability of the central conductive filament in the low resistance state. The present application further discloses a method for manufacturing the ReRAM device.

Numerous embodiments of circuitry for a set-while-verify operation and a reset-while verify operation for resistive random access memory cells are disclosed. In one embodiment, a set-while-verify circuit for performing a set operation on a selected RRAM cell in the array applies a combination of voltages or current to a bit line, word line, and source line associated with the selected RRAM cell and stops said applying when the set operation is complete. In another embodiment, a reset-while-verify circuit for performing a reset operation on a selected RRAM cell in the array applies a combination of voltages or current to a bit line, word line, and source line associated with the selected RRAM cell and stops said applying when the reset operation is complete.

According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member has a first end and a second end opposite to the first end. The first end is disposed towards the transistor, and the second end is disposed towards the dielectric member. The contact member has a side surface extending from the first end to the second end. The second end may have a recessed end surface that has a section that slopes towards the side surface so as to form a tip with the side surface at the second end. The dielectric member may be disposed over the second end of the contact member and may include at least a portion disposed over the tip.

A resistive memory includes: a bottom electrode; a first contact on the bottom electrode; a switching material pad on the first contact, wherein the switching material pad includes an oxide and a plurality of current conducting filaments in the oxide; a top electrode on the switching material pad; a plurality of sacrificial vias contacting the bottom electrode; a second contact that is connected to the bottom electrode; and a third contact that is connected to the top electrode.

Electrical switching technologies employ the otherwise undesirable line defect in crystalline materials to form conductive filaments. A switching cell includes a crystalline layer disposed between an active electrode and another electrode. The crystalline layer has at least one channel, such as a line defect, extending from one surface of the crystalline layer to the other surface. Upon application of a voltage on the two electrodes, the active electrode provides metal ions that can migrate from the active electrode to the other electrode along the line defect, thereby forming a conductive filament. The switching cell can precisely locate the conductive filament within the line defect and increase the device-to-device switching uniformity.

A semiconductor structure may include two vertical transport field effect transistors comprising a top source drain, a bottom source drain, and an epitaxial channel and a resistive random access memory between the two vertical transport field effect transistors, the resistive random access memory may include an oxide layer, a top electrode, and a bottom electrode, wherein the oxide layer may contact the top source drain of the two vertical field effect transistor. The top source drain may function as the bottom electrode of the resistive random access memory. The semiconductor structure may include a shallow trench isolation between the two vertical transport field effect transistors, the shallow trench isolation may be embedded in a first spacer, a doped source, and a portion of a substrate.