Disclosed is a synaptic device, a reservoir computing device using the synaptic device, and a reservoir computing method using the reservoir computing device. The synaptic device includes a substrate and a plurality of units cells on the substrate, wherein the unit cells each include a channel layer and a first electrode and second electrode intersecting the channel layer, wherein the first electrode and the second electrode are spaced apart from each other, and define a gap region exposing a portion of the channel layer, and the channel layer includes a 2-dimensional semiconductor material or a 2-dimensional ferroelectric material.

An example apparatus can include a memory array and a memory controller. The memory array can include a first portion including a first plurality of memory cells. The memory array can further include a second portion including a second plurality of memory cells. The memory controller can be coupled to the first portion and the second portion. The memory controller can be configured to operate the first plurality of memory cells for short-term memory operations. The memory controller can be further configured to operate the second plurality of memory cells for long-term memory operations.

An electronic device includes a base element, a source electrode layer and a drain electrode layer disposed to be spaced apart from each other on the base element, a channel layer disposed between the source electrode layer and the drain electrode layer on the base element that accommodates metal ions, a metal ion conduction layer disposed on the channel layer, and a gate electrode layer disposed on the metal ion conduction layer. The channel layer includes a plurality of unit films and channel spaces between the plurality of unit films. The plurality of unit films are arranged to be parallel to a direction substantially perpendicular to a surface of the base element.

A semiconductor device includes logic circuitry including a transistor disposed over a substrate, multiple layers each including metal wiring layers and an interlayer dielectric layer, respectively, disposed over the logic circuitry, and memory arrays. The multiple layers of metal wiring include, in order closer to the substrate, first, second, third and fourth layers, and the memory arrays include lower multiple layers disposed in the third layer.

An apparatus of fabricating a semiconductor device may include a chamber including a housing and a slit valve used to open or close a portion of the housing, a heater chuck provided in a lower region of the housing and used to heat a substrate, a target provided over the heater chuck, a plasma electrode provided in an upper region of the housing and used to generate plasma on the target, a heat-dissipation shield surrounding the inner wall of the housing between the plasma electrode and the heater chuck, and an edge heating structure provided between the heat-dissipation shield and the inner wall of the housing and configured to heat the heat-dissipation shield and an edge region of the substrate and to reduce a difference in temperature between center and edge regions of the substrate.

Methods, systems, and devices for multi-component cell architectures for a memory device are described. A memory device may include self-selecting memory cells that include multiple self-selecting memory components (e.g., multiple layers or other segments of a self-selecting memory material, separated by electrodes). The multiple self-selecting memory components may be configured to collectively store one logic state based on the polarity of a programming pulse applied to the memory cell. The multiple memory component layers may be collectively (concurrently) programmed and read. The multiple self-selecting memory components may increase the size of a read window of the memory cell when compared to a memory cell with a single self-selecting memory component. The read window for the memory cell may correspond to the sum of the read windows of each self-selecting memory component.

The present disclosure includes apparatuses and methods for material implication operations in memory with reduced program voltages. An example apparatus can include an array of memory cells that further includes a first memory cell coupled to a first access line and to a first one of a plurality of second access lines and a second memory cell coupled to the first access line and to a second one of the plurality of second access lines. The circuitry can be configured to apply, across the second memory cell, a first voltage differential having a first polarity and a first magnitude. The first voltage differential reduces, if the second memory cell is programmed to a first data state, a magnitude of a drifted threshold voltage for programming the second memory cell to a second data state. The circuitry is further configured to apply, subsequent to the application of the first voltage differential, a first signal to the first access line. The circuitry is further configured to, while the first signal is being applied to the first access line, apply, subsequent to the application of the first voltage differential, a second voltage differential having a second polarity and the first magnitude across the first memory cell and apply a third voltage differential having the second polarity across the second memory cell. A material implication operation is performed as a result of the first, second, and third voltage differentials applied across the first and the second memory cells with a result of the material implication operation being stored on the second memory cell.

The present disclosure relates to a chalcogenide material including germanium (Ge) with a first atomic percent, selenium (Se) with a second atomic percent that is at least twice the first atomic percent of the germanium, and indium (In) with a third atomic percent less the first atomic percent of the germanium.

A memory cell is disclosed. The memory cell includes a storage component that includes a chalcogenide stack that includes a plurality of layers of material and a selector component that includes a Schottky diode.

A three-dimensional semiconductor memory device includes first conductive lines extending horizontally in a first direction, a second conductive line extending vertically in a second direction perpendicular to the first direction, and memory cells at cross-points between the first conductive lines and the second conductive line. The first conductive lines are laterally spaced apart from each other in a third direction crossing the first direction. Each of the memory cells includes a variable resistance element and a switching element that are horizontally arranged. The variable resistance element includes a first variable resistance pattern and a second variable resistance pattern arranged in the second direction, a first electrode between the first variable resistance pattern and the first conductive line, a second electrode between the second variable resistance pattern and the second conductive line, and a third electrode between the first variable resistance pattern and the second variable resistance pattern.