Patent classifications
H01B3/442
Heat-resistant silane crosslinked resin molded body and method of producing the same, heat-resistant silane crosslinkable resin composition and method of producing the same, silane master batch, and heat-resistant product using heat-resistant silane crosslinked resin molded body
A method comprising at least a step of preparing a silane master batch by melt-kneading a base resin (R.sub.B) containing a non-aromatic organic oil, an organic peroxide, an inorganic filler, and a silane coupling agent, in specific mass ratio, and a step of mixing the silane master batch and a silanol condensation catalyst or a silane master batch; a heat-resistant silane crosslinked resin molded body and a heat-resistant silane crosslinkable resin composition prepared by the method, and a silane master batch and a heat-resistant product.
Masterbatches for preparing composite materials with enhanced conductivity properties, process and composite materials produced
A masterbatch for use in a process of preparing a composite material may contain a blend of a first amorphous polymer with carbon nanotubes. At least 5% by weight of carbon nanotubes may be present in the masterbatch, based on a total weight of the masterbatch. The masterbatch may exhibit a high load melt flow index HLMI1 of less than 40 g/10 min determined at 200 C. under a load of 21.6 kg according to ISO1133. The first amorphous polymer may have a melt flow index MFI1 of at least 10 g/10 min determined at 200 C. under a load of 5 kg according to ISO1133H.
RESIN CURED PRODUCT, ELECTRICAL DEVICE, MOTOR, TRANSFORMER, CABLE SHEATH, MOBILE, STRUCTURE, AND METHOD FOR HEALING RESIN CURED PRODUCT
In a conventional self-healing material, although the resin properties after self-healing are restored to the same level as the initial refractoriness and strength of the resin, no further extension of life can be expected. A resin cured product according to the present invention includes: a first vinyl monomer having an ester bond; a second vinyl monomer having a hydroxyl group; a transesterification reaction catalyst; and a boron compound.
Flexible, UV resistant poly(phenylene ether) composition and insulated conductor and jacketed cable comprising it
A composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a low molecular weight polybutene, a flame retardant, an ultraviolet absorbing agent, and a poly(alkylene oxide). The composition is useful as an insulation or jacketing material for wires and cables.
ELECTRICALLY CONDUCTIVE FILM
An electroconductive film including a resin layer and an electroconductive layer, wherein the resin layer has a storage elastic modulus at 25 C. of more than 10 MPa and less than 1,000 MPa, and the electroconductive layer has a surface resistance value of 1,000 /sq. or less.
Insulated Wire
An insulated wire having an electrical wire structure capable of reducing an outer diameter while an insulation property and a flame-retardant property are highly kept is provided. In the insulated wire including: a conductor; and a coating layer arranged on an outer periphery of the conductor, the coating layer includes: a semiconductive layer having a volume resistivity defined by JIS C2151 that is equal to or smaller than 1.010.sup.15 (cm); an insulating layer arranged on an outer periphery of the semiconductive layer, the insulating layer having a volume resistivity defined by JIS C2151 that is larger than 5.010.sup.15 (cm); and a flame-retardant semiconductive layer arranged on an outer periphery of the insulating layer, the flame-retardant semiconductive layer having a volume resistivity defined by JIS C2151 that is equal to or smaller than 1.510.sup.15 (cm) and having an oxygen index defined by JIS K7201-2 that is larger than 40.
FLEXIBLE, UV RESISTANT POLY(PHENYLENE ETHER) COMPOSITION AND INSULATED CONDUCTOR AND JACKETED CABLE COMPRISING IT
A composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a low molecular weight polybutene, a flame retardant, an ultraviolet absorbing agent, and a poly(alkylene oxide). The composition is useful as an insulation or jacketing material for wires and cables.
ION DIPOLES CONTAINING POLYMER COMPOSITIONS
A dielectric polymer, methods of making the dielectric polymer, and uses thereof (e.g. piezoelectric sensors and/or actuators) are described. The dielectric polymer includes a polymeric matrix (e.g. a copolymers of styrene and acrylonitrile SAN, or a terpolymer of the former with methyl methacrylate MMA-SAN) derived from at least one polymerizable vinyl monomer and an ionic liquid that includes an organic cation and a balancing anion (e.g. 1-butyl-3-methylimidazolium hexafluorophosphate BMMMPF6). The ionic liquid is compatible with the at least one polymerizable vinyl monomer and the concentration of the ionic liquid in the dielectric polymeric composition ranges from 0.5 wt. % to less than 30 wt. %.
Polypropylene resin composition and cable cladded with the same
The present invention relates to a polypropylene resin composition and a cable cladded with the same. More particularly, the present invention relates to a polypropylene resin composition, including 25 to 35% by weight of a polypropylene polymer, 15 to 25% by weight of a styrene block copolymer, 15 to 25% by weight of a poly(arylene ether) resin, 26 to 35% by weight of a phosphorus flame retardant, and 0 to 10% by weight of a processing additive. In accordance with the present invention, a polypropylene resin composition including a small amount of flame retardant but exhibiting excellent flame resistance, insulation performance, processability, and property balance, and a cable cladded with the same are provided.
Transparent conductive film
A transparent conductive film 1 includes, in this order, a transparent substrate 2, a first optical adjustment layer 4, an inorganic layer 5, and a transparent conductive layer 6. The first optical adjustment layer 4 has refractive index nC lower than refractive index nA of the transparent substrate 2, and thickness TC of 10 nm or more and 35 nm or less. The inorganic layer 5 has refractive index nD that is lower than the absolute value |nC1.13| of a value obtained by multiplying the refractive index nC of the first optical adjustment layer 4 by 1.13.