A method making a three-dimensional inductor, the method including: forming a plurality of vias in a substrate or a molding compound, wherein the vias are arranged with spacings among them; forming a metal layer having interconnects, wherein the interconnects of the metal layer connect the plurality of vias on one end of the vias; forming a plurality of wires to connect the plurality of vias on the other end of the vias to form the 3D inductor; and tuning one or more of the plurality of wires to adjust a physical configuration and inductance value of the 3D inductor.

An inductor may include a body and external electrodes on respective external surfaces of the body. The body may include a support member, an insulator on the support member and including a first opening, a coil in the first opening, and a thin film conductor layer between the coil and the support member. The thin film conductor layer may include a second opening, and one or both of its end portions may be between the support member and the insulator.

A coil component is disclosed. The coil component includes a body having one surface and the other surface opposing each other, and a plurality of wall surfaces connecting one surface and the other surface to each other; a coil part embedded in the body and having both ends exposed to both end surfaces of the plurality of wall surfaces of the body, opposing each other; an insulating layer covering one surface of the body; and first and second external electrodes disposed on both end surfaces of the body, respectively, to extend onto the insulating layer, and including a bonded conductive layer disposed on the insulating layer, and an external conductive layer disposed on the bonded conductive layer, respectively.

An electronic component includes a magnetic body including a resin and first magnetic powder and having a recess on a lower surface of the magnetic body, an internal coil portion embedded in the magnetic body, and external electrodes disposed on opposing ends of the magnetic body in a length direction of the magnetic body and connected to ends of the internal coil portion, wherein the first magnetic powder disposed on a surface of the recess may have a cut surface.

An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.

A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond pad layer, and the middle metal layer may comprise a copper tub region formed between the aluminum upper layer and copper lower layer. The wide copper region defining the middle layer of the metal layer stack may be formed concurrently with copper vias of interconnect structures in the IC device, e.g., by filling respective openings using copper electrochemical plating or other bottom-up fill process. The elongated inductor wire may be shaped in a spiral or other symmetrical or non-symmetrical shape.

A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.

A microcoil element, an array-type microcoil element and a device are provided. The microcoil element includes a wiring layer having continuous multiple metal line segments that form multiple loops around a starting point of the element. Every metal line segment includes a first electrode end and a second electrode end. The microcoil element includes an electrode layer having a first electrode zone and a second electrode zone that respectively collect the first electrode ends and the second electrode ends of the multiple metal line segments. When designing the microcoil element, parameters such as a total length of the multiple line segments, a line width, a line spacing of adjacent line segments, a length of each line segment, turns of the microcoil, and a loop distance according to impedance requirement. The single microcoil element or the array-type microcoil element can be used as a magnetic component of a device.

A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond pad layer, and the middle metal layer may comprise a copper tub region formed between the aluminum upper layer and copper lower layer. The wide copper region defining the middle layer of the metal layer stack may be formed concurrently with copper vias of interconnect structures in the IC device, e.g., by filling respective openings using copper electrochemical plating or other bottom-up fill process. The elongated inductor wire may be shaped in a spiral or other symmetrical or non-symmetrical shape.

An LC resonance element (10) includes a dielectric film (12), a common electrode (11) formed of a thin-film conductor on a lower surface (12D) of the dielectric film, a first capacitor (C1) and a second capacitor (C2) that are connected in series via the common electrode (11) and constitute a thin-film capacitor (TC), first and second external connection terminals (14A, 14B) formed on an upper surface (12U) of the dielectric film, a thin-film conductive wire (16) constituting a thin-film inductor (TL), a first upper electrode (13A) of the first capacitor formed on the upper surface (12U), and a second upper electrode (13B) of the second capacitor formed on the upper surface (12U). The thin-film conductive wire (16) is formed in a region (R2) located on the upper surface (12U) of the dielectric film and outside the common electrode (11) in plan view.