Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrill comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.

An electronic component includes a semiconductor substrate having a main surface and containing a semiconductor material, and a coil provided on the main surface and composed of a conductive material. The semiconductor substrate includes a low-resistance portion having a lower electrical resistance than a semiconductor composed of the semiconductor material. The coil is electrically connected to the low-resistance portion. An axial direction of the coil is parallel to the main surface.

In a photosensitive conductive paste containing photosensitive organic components, conductor powder, and quartz powder, melting of the quartz powder does not occur or is very unlikely to occur in a heat treatment step, and in the heat treatment step, it functions sufficiently to bring shrinkage rates and shrinkage behaviors of both of a conductor layer and an element body layer closer to each other when they shrink, and thus generation of voids can be inhibited when it is used for manufacturing a laminated coil component.

Ultrathin and flexible electrical devices including circuit dies such as, for example, a capacitor chip, a resistor chip, and/or an inductor chip, and methods of making and using the same are provided. Circuit dies are attached to a major surface of a flexible substrate having channels Electrically conductive traces are formed in the channels, self-aligned with the circuit dies, and in direct contact with the bottom surface of the circuit dies.

A coil electronic component includes a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil, and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns, each of the plurality of coil patterns includes a lower coil pattern in contact with the support member and an upper coil pattern on the lower coil pattern, a line width and a thickness of the lower coil pattern are uniform in along the internal coil, and a line width and a thickness of the upper coil pattern are increased in a direction from the center of the internal coil to the outermost portion of the internal coil.

This disclosure relates generally to substrates having three dimensional (3D) inductors and methods of manufacturing the same. In one embodiment, the 3D inductor is a solenoid inductor where the exterior edge contour of the winding ends is substantially the same and substantially aligned with the exterior edge contour of the exterior edge contour of conductive vias that connect the windings. In this manner, there is no overhang between the windings and the conductive vias. In another embodiment of the 3D inductor, via columns connect connector plates. The via column attachment surfaces of each of the conductive vias in each of the columns is the same and substantially aligned. In this manner, carrier pads are not needed and there is no overhand between the conductive vias.

A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.

Provided is a chip inductor and manufacturing method thereof. The chip inductor includes: a pin layer, a plurality of insulating layers and a plurality of metal layers, where the insulating layers and the metal layers are arranged successively and alternately on the pin layer. Multiple patterned metal structures arranged in the plurality of metal layers are respectively electrically connected to form a multilayer plane spiral coil structure. The multilayer plane spiral coil structure has two ends electrically connected with respective pin structures in the pin layer.

A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.

The present disclosure relates to an electromagnetic induction film and a manufacturing method thereof, an electromagnetic induction panel and a manufacturing method thereof, and a touch display device. The method for manufacturing the electromagnetic induction film may include: arranging a plurality of first conductors in parallel along and spaced apart along a first direction on a substrate; arranging an insulating layer on the plurality of first conductors; arranging a plurality of second conductors in parallel and spaced apart along the first direction on the insulating layer; and electrically connecting head end areas of the first conductors to head end areas of the second conductors and electrically connecting tail end areas of the first conductors to tail end areas of the second conductors to form an electromagnetic induction coil spirally surrounding the insulating layer.