Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

The present disclosure relates to a coil assembly. According to a first embodiment of the present disclosure, there is provided a coil assembly including a coil including a multilayer film which is extended between a first longitudinal end and a second longitudinal end of the multilayer film, which are opposite to each other, and which is wound to form a plurality of loops which are substantially concentric, wherein the multilayer film includes: cut edges which are extended between the first longitudinal end and the second longitudinal end, and are opposite to each other and are substantially parallel to each other; a metal layer; and a magnetic layer disposed on the metal layer, wherein, at one or more of the first longitudinal end and the second longitudinal end of the multilayer film, the metal layer is electrically connected to a conductive terminal.

Embodiments disclosed herein include electronic packages with embedded magnetic materials and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of dielectric layers. In an embodiment a plurality of passive components is located in a first dielectric layer of the plurality of dielectric layers. In an embodiment, first passive components of the plurality of passive components each comprise a first magnetic material, and second passive components of the plurality of passive components each comprise a second magnetic material. In an embodiment, a composition of the first magnetic material is different than a composition of the second magnetic material.

Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a plug is formed through the core, where the plug comprises a magnetic material. In an embodiment, an inductor is around the plug. In an embodiment, first layers are over the core, wherein where the first layers comprise a dielectric material; and second layers are under the core, where the second layers comprise the dielectric material.

A multilayer coil component includes: an element body formed by stacking a magnetic body layer containing a plurality of metal magnetic particles of a soft magnetic material; a first coil disposed in the element body and configured to include a plurality of first coil conductors; a second coil disposed in the element body and configured to include a plurality of second coil conductors; a first external electrode to which one end portion of each of the first coil and the second coil is connected; and a second external electrode to which the other end portion of each of the first coil and the second coil is connected.

A device includes (a) an integrated inductor having an inductor wire and (b) a metal interconnect arrangement, both formed in an integrated circuit layer stack of alternating metal layers and via layers. At least a portion of the inductor wire is defined by an inductor element stack including multiple metal layer inductor elements formed in multiple respective metal layers, and multiple via layer inductor elements formed in multiple respective via layers and conductively connected to the metal layer inductor elements. Each via layer inductor element has a length of at least 1 μm in each of two lateral directions orthogonal to each other and perpendicular to the vertical direction. The metal interconnect arrangement includes metal layer interconnect elements formed in the respective metal layers, and interconnect vias formed in the respective via layers.

A coil component including an element assembly that contains a filler and a resin material, a coil portion composed of a coil conductor that is embedded in the element assembly, and a pair of outer electrodes electrically connected to the coil conductor. The outer electrodes are disposed on a lower surface, and the coil axis of the coil portion is parallel to a mounting surface.

A multilayer coil array includes an element body; first and second built-in coils; and first to fourth outer electrodes provided on the element body. A non-magnetic layer is provided between the first and second coils. An end of the first coil extending from the coil conductor closest to the second coil among the plurality of coil conductors of the first coil is connected to the first outer electrode and another end of the first coil is connected to the second outer electrode. An end of the second coil extending from the coil conductor closest to the first coil among the plurality of coil conductors of the second coil is connected to the third outer electrode and another end portion of the second coil is connected to the fourth outer electrode. The second and fourth outer electrodes are connected to output terminals of a switching element of a DC-DC converter.

A coil component includes an element body including a magnetic portion containing metal particles and a coil conductor embedded in the magnetic portion, and at least a pair of outer electrodes disposed on the element body and electrically connected to the coil conductor. The magnetic portion includes a region A containing metal particles having a relatively small average particle size and a region B containing metal particles having a relatively large average particle size. The region A is present between outer electrodes of the pair of outer electrodes and the coil conductor.