An electronic package is provided and includes an electronic element connected to a plurality of inductor circuits embedded in an insulator of a package substrate by fan-out conductive copper pillars, and at least one shielding layer non-electrically connected to the inductor circuits, where the shielding layer includes a plurality of line segments not connected to each other, such that the shielding layer shields the inductor circuits, thereby achieving the electrical requirements of high-current products while improving the inductance value and quality factor.

In an exemplary embodiment, a coil component includes: an element body part 10 and a coil 30 of spiral shape constituted by multiple turn units 32 connected in a coil axial direction; wherein each turn unit 32 has, in a cross-sectional view in the width direction of the turn unit 32, a flat side 40 that extends in a second direction substantially perpendicular to the coil axis of the coil 30; and the point of intersection 48 between a figure line 42 corresponding to the longest part in a first direction, and a figure line 44 corresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure line 42 within one-quarter of the figure line away from one end 50 on the side 40 or from the other end 52 opposing the side 40.

A multilayer coil component includes an element body and a plurality of coil conductors. The element body includes a plurality of metal magnetic particles and resin existing between the plurality of metal magnetic particles. The plurality of coil conductors is disposed in the element body, the plurality of coil conductors being separated from each other in a predetermined direction and electrically connected to each other. The plurality of metal magnetic particles included in the element body includes a plurality of metal magnetic particles having a particle size equal to or greater than one third of a distance between the coil conductors adjacent to each other in the predetermined direction and equal to or less than a half of the distance. Between the coil conductors adjacent to each other in the predetermined direction, the metal magnetic particles having the particle size are distributed along the predetermined direction.

A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D.sub.50 of 1.3 μm or more and 5.0 μm or less (i.e., from 1.3 μm to 5.0 μm), and second particles having a median diameter D.sub.50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

A multilayer coil component includes a body including laminated ferrite layers, a coil conductor including conductive layers laminated in the body, and a pair of outer electrodes disposed on a lower surface of the body. Each of the pair of outer electrodes is electrically connected to a corresponding one of end portions of the coil conductor. Each of the outer electrodes includes an underlying electrode and a plating layer disposed on the underlying electrode. The underlying electrode is disposed at a distance from a side surface of the body.

An electronic component includes a glass ceramic layer and a conductor layer. The glass ceramic layer includes feldspar crystal phases, non-crystalline glass phases, and Al.sub.2O.sub.3 phases. The area ratio of the feldspar crystal phases in the vicinity of the conductor layer is larger than the area ratio of the feldspar crystal phases away from the conductor layer.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, a distance between the first portion and the third surface is larger than a distance between the third portion and the fifth surface.

An electronic component includes a body having a mounting surface which faces a mounting substrate and an exposure surface from which an extended wiring line is exposed, a first electrode attached to the mounting surface, and a second electrode which is electrically connected to the extended wiring line and which is attached to the exposure surface. The first electrode and the second electrode second electrode are spaced from each other.

An inductor conductor is configured such that, with respect to a height-wise dimension of the inductor conductor between the top surface and the bottom surface thereof, the height-wise dimension of a central portion of the top surface is smaller than the height-wise dimension of an edge portion of the top surface at a cross section of the inductor conductor taken in a direction orthogonal to an extending direction of the inductor conductor.